{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,11,4]],"date-time":"2025-11-04T11:09:19Z","timestamp":1762254559000,"version":"3.37.3"},"reference-count":19,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,5,22]],"date-time":"2023-05-22T00:00:00Z","timestamp":1684713600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,5,22]],"date-time":"2023-05-22T00:00:00Z","timestamp":1684713600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/100000001","name":"National Science Foundation","doi-asserted-by":"publisher","id":[{"id":"10.13039\/100000001","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,5,22]]},"DOI":"10.1109\/ets56758.2023.10174135","type":"proceedings-article","created":{"date-parts":[[2023,7,12]],"date-time":"2023-07-12T17:20:34Z","timestamp":1689182434000},"page":"1-6","source":"Crossref","is-referenced-by-count":3,"title":["Test-Point Insertion for Power-Safe Testing of Monolithic 3D ICs using Reinforcement Learning<sup>*<\/sup>"],"prefix":"10.1109","author":[{"given":"Shao-Chun","family":"Hung","sequence":"first","affiliation":[{"name":"Duke University,Department of Electrical &#x0026; Computer Engineering,USA"}]},{"given":"Arjun","family":"Chaudhuri","sequence":"additional","affiliation":[{"name":"Duke University,Department of Electrical &#x0026; Computer Engineering,USA"}]},{"given":"Krishnendu","family":"Chakrabarty","sequence":"additional","affiliation":[{"name":"Arizona State University,School of Electrical, Computer and Energy Engineering,USA"}]}],"member":"263","reference":[{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/DAC18074.2021.9586138"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/DAC18074.2021.9586188"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/MDT.2002.1003802"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/DAC18072.2020.9218582"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1038\/s41586-021-03544-w"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-642-27645-3"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2019.2897589"},{"key":"ref1","first-page":"714","article-title":"3D sequential integration: A key enabling technology for heterogeneous co-integration of new function with CMOS","volume":"2","author":"batude","year":"2012","journal-title":"IEEE JETCAS"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2010.2043591"},{"key":"ref16","article-title":"Robust analytical gate delay modeling for low voltage circuits","author":"ramalingam","year":"2006","journal-title":"ASPDAC"},{"key":"ref19","first-page":"1","article-title":"Stable-Baselines3: Reliable reinforcement learning implementations","volume":"22","author":"raffin","year":"2021","journal-title":"Journal of Machine Learning Research"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1145\/2160916.2160950"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/VTSA.2007.378923"},{"key":"ref7","article-title":"Formal test point insertion for region-based low-capture-power compact at-speed scan test","author":"eggersgl\u00fc\u00df","year":"2016","journal-title":"IEEE Asian Test Symposium"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/VTS.2019.8758650"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2021.3108787"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ICECS.2016.7841254"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/DFTVS.2002.1173510"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2002.1041754"}],"event":{"name":"2023 IEEE European Test Symposium (ETS)","start":{"date-parts":[[2023,5,22]]},"location":"Venezia, Italy","end":{"date-parts":[[2023,5,26]]}},"container-title":["2023 IEEE European Test Symposium (ETS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10173930\/10173940\/10174135.pdf?arnumber=10174135","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,8,1]],"date-time":"2023-08-01T17:55:52Z","timestamp":1690912552000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10174135\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,5,22]]},"references-count":19,"URL":"https:\/\/doi.org\/10.1109\/ets56758.2023.10174135","relation":{},"subject":[],"published":{"date-parts":[[2023,5,22]]}}}