{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,7,11]],"date-time":"2026-07-11T06:12:09Z","timestamp":1783750329125,"version":"3.55.0"},"reference-count":19,"publisher":"IEEE","license":[{"start":{"date-parts":[[2026,5,25]],"date-time":"2026-05-25T00:00:00Z","timestamp":1779667200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2026,5,25]],"date-time":"2026-05-25T00:00:00Z","timestamp":1779667200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100003711","name":"Ministry of Science and Technology","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100003711","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2026,5,25]]},"DOI":"10.1109\/ets69887.2026.11591818","type":"proceedings-article","created":{"date-parts":[[2026,7,10]],"date-time":"2026-07-10T19:37:01Z","timestamp":1783712221000},"page":"1-6","source":"Crossref","is-referenced-by-count":0,"title":["An Elmore Delay Model Based Test Method for Post-Bond TSVs"],"prefix":"10.1109","author":[{"given":"Zhicheng","family":"Shao","sequence":"first","affiliation":[{"name":"School of ECE Peking University,Shenzhen,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Xiaole","family":"Cui","sequence":"additional","affiliation":[{"name":"School of ECE Peking University,Shenzhen,China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Xiaoxin","family":"Cui","sequence":"additional","affiliation":[{"name":"School of Micro\/Nano Electronics Peking University Beijing,China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/VTS52500.2021.9794149"},{"key":"ref2","first-page":"1031","article-title":"Small delay testing for TSVs in 3-D ICs","volume-title":"Proc. DAC Design Automation Conf.","author":"Huang"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ETS56758.2023.10174179"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/APCCAS62602.2024.10808969"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ETS.2016.7519291"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2024.3514732"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2018.2887051"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/EPEPS.2011.6100237"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ATS.2010.73"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2012.2187543"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/PATMOS.2017.8106985"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/3DIC48104.2019.9058908"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/icee67339.2025.11213557"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/ICICM59499.2023.10365804"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1049\/iet-cdt.2013.0096"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/9780470544389"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1145\/1146909.1146993"},{"key":"ref18","article-title":"Nangate open cell library, 45 nm CMOS process: Standard cell library databook","year":"2011"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2013.2289964"}],"event":{"name":"2026 IEEE European Test Symposium (ETS)","location":"Chania, Greece","start":{"date-parts":[[2026,5,25]]},"end":{"date-parts":[[2026,5,29]]}},"container-title":["2026 IEEE European Test Symposium (ETS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/11591470\/11591504\/11591818.pdf?arnumber=11591818","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,7,11]],"date-time":"2026-07-11T05:16:07Z","timestamp":1783746967000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11591818\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,5,25]]},"references-count":19,"URL":"https:\/\/doi.org\/10.1109\/ets69887.2026.11591818","relation":{},"subject":[],"published":{"date-parts":[[2026,5,25]]}}}