{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,7,11]],"date-time":"2026-07-11T06:12:53Z","timestamp":1783750373355,"version":"3.55.0"},"reference-count":19,"publisher":"IEEE","license":[{"start":{"date-parts":[[2026,5,25]],"date-time":"2026-05-25T00:00:00Z","timestamp":1779667200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2026,5,25]],"date-time":"2026-05-25T00:00:00Z","timestamp":1779667200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2026,5,25]]},"DOI":"10.1109\/ets69887.2026.11591851","type":"proceedings-article","created":{"date-parts":[[2026,7,10]],"date-time":"2026-07-10T19:37:01Z","timestamp":1783712221000},"page":"1-6","source":"Crossref","is-referenced-by-count":0,"title":["A Circular Repair Scheme for 3DIC Die-to-Die Interconnects"],"prefix":"10.1109","author":[{"given":"Anshuman","family":"Chandra","sequence":"first","affiliation":[{"name":"Siemens EDA,Fremont,USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Moiz","family":"Khan","sequence":"additional","affiliation":[{"name":"Siemens EDA,Fremont,USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Barbara","family":"Dzia\u0142owska","sequence":"additional","affiliation":[{"name":"Siemens EDA,Fremont,USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Marta","family":"St\u0119pniewska","sequence":"additional","affiliation":[{"name":"Siemens EDA,Fremont,USA"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/5.929647"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/MDT.2005.136"},{"key":"ref4","article-title":"3D Interconnect Test Challenges","volume-title":"Proceedings of the IEEE European Test Symposium, (ETS)"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ITC58126.2025.00094"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2013.6651893"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/DATE.2010.5457218"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2009.2034408"},{"key":"ref9","volume-title":"UCIe) Specification Revision","year":"2023"},{"key":"ref10","article-title":"Accelerating Innovation Through A Standard Chiplet Interface: The Advanced Interface Bus (AIB)","author":"Kehlet","journal-title":"Intel White Paper"},{"key":"ref11","article-title":"High Bandwidth Memory (HBM) DRAM","volume-title":"Technical Report JESD235D, JEDEC","year":"2021"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/DATE.2012.6176602"},{"key":"ref13","first-page":"848","article-title":"Architecture of ring-based redundant TSV for clustered faults","volume-title":"Proc. Des., Auto. Test Eur. Conf. Exhib.","author":"Lo"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/ETS56758.2023.10174179"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/ATS66998.2025.00021"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/ETS63895.2025.11049312"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/ATS66998.2025.00017"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2024.3466809"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/ITC-Asia67627.2025.00009"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1149\/2162-8777\/ac7662"}],"event":{"name":"2026 IEEE European Test Symposium (ETS)","location":"Chania, Greece","start":{"date-parts":[[2026,5,25]]},"end":{"date-parts":[[2026,5,29]]}},"container-title":["2026 IEEE European Test Symposium (ETS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/11591470\/11591504\/11591851.pdf?arnumber=11591851","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,7,11]],"date-time":"2026-07-11T05:26:45Z","timestamp":1783747605000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11591851\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,5,25]]},"references-count":19,"URL":"https:\/\/doi.org\/10.1109\/ets69887.2026.11591851","relation":{},"subject":[],"published":{"date-parts":[[2026,5,25]]}}}