{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,10,25]],"date-time":"2026-10-25T07:37:51Z","timestamp":1792913871549,"version":"4.5.0"},"reference-count":14,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2014,5]]},"DOI":"10.1109\/ewme.2014.6877406","type":"proceedings-article","created":{"date-parts":[[2014,8,20]],"date-time":"2014-08-20T15:06:55Z","timestamp":1408547215000},"page":"106-111","source":"Crossref","is-referenced-by-count":4,"title":["Trends in nanoelectronic education from FDSOI and FinFET technologies to circuit design specifications"],"prefix":"10.1109","author":[{"given":"Olivier","family":"Bonnaud","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Laurent","family":"Fesquet","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"issue":"8","key":"ref1","first-page":"114","article-title":"Cramming more components onto integrated circuits","volume":"38","author":"Moore","year":"1965","journal-title":"Electronics Magazine"},{"key":"ref2","article-title":"Coordination Nationale pour la Formation en Microelectronique et en nanotechnologies","volume-title":"this network is financially supported by the French Ministry of Higher Education"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/MSE.1997.612575"},{"key":"ref4","article-title":"GIP-CNFM: a potential model for micro and nanoelectronics education","volume-title":"Design and Technology of Integrated Systems in nanoscale era (DTIS \u2018 2008)","author":"Bonnaud"},{"key":"ref6","article-title":"More-than-Moore","volume-title":"White Paper","author":"Arden","year":"2010"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1149\/1.2357050"},{"issue":"1","key":"ref8","first-page":"461","article-title":"World Academy of Science","volume":"8","author":"Shen","year":"2011","journal-title":"engineering and technology"},{"issue":"1","key":"ref9","first-page":"29","article-title":"ECS Trans","volume":"37","author":"Bonnaud","year":"2011"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1016\/j.mee.2007.04.038"},{"key":"ref11","volume-title":"(22 authors). Electron Devices Meeting, 2006. IEDM\u201906. International","author":"Ernst"},{"key":"ref13","article-title":"Introduction to VLSI Systems","author":"Mead","year":"1979"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1201\/9781420039559"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1007\/978-0-387-69954-7"},{"key":"ref17","article-title":"Formations Innovantes en Microelectronique et N anotechnologies","volume-title":"n\u00b0 ANR-11-IDFI-0017"}],"event":{"name":"2014 10th European Workshop on Microelectronics Education (EWME)","location":"Tallinn, Estonia","start":{"date-parts":[[2014,5,14]]},"end":{"date-parts":[[2014,5,16]]}},"container-title":["10th European Workshop on Microelectronics Education (EWME)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6868743\/6877377\/06877406.pdf?arnumber=6877406","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,10,25]],"date-time":"2026-10-25T07:04:19Z","timestamp":1792911859000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6877406\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2014,5]]},"references-count":14,"URL":"https:\/\/doi.org\/10.1109\/ewme.2014.6877406","relation":{},"subject":[],"published":{"date-parts":[[2014,5]]}}}