{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,2,28]],"date-time":"2025-02-28T05:21:46Z","timestamp":1740720106582,"version":"3.38.0"},"reference-count":6,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,10,13]],"date-time":"2024-10-13T00:00:00Z","timestamp":1728777600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,10,13]],"date-time":"2024-10-13T00:00:00Z","timestamp":1728777600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,10,13]]},"DOI":"10.1109\/fie61694.2024.10893112","type":"proceedings-article","created":{"date-parts":[[2025,2,26]],"date-time":"2025-02-26T18:43:35Z","timestamp":1740595415000},"page":"1-5","source":"Crossref","is-referenced-by-count":0,"title":["WIP: An Experiential Undergraduate Certificate in Semiconductor Engineering and Physics"],"prefix":"10.1109","author":[{"given":"Jackson","family":"Anderson","sequence":"first","affiliation":[{"name":"University of Vermont,College of Engineering and Mathematical Sciences,Burlington,VT,USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jeff","family":"Frolik","sequence":"additional","affiliation":[{"name":"University of Vermont,College of Engineering and Mathematical Sciences,Burlington,VT,USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Matthew","family":"Gallagher","sequence":"additional","affiliation":[{"name":"University of Vermont,College of Engineering and Mathematical Sciences,Burlington,VT,USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Randall","family":"Headrick","sequence":"additional","affiliation":[{"name":"University of Vermont,College of Engineering and Mathematical Sciences,Burlington,VT,USA"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"year":"2022","journal-title":"FACT SHEET: CHIPS and Science Act","key":"ref1"},{"volume-title":"Semiconductor Industry As-sociation","year":"2023","article-title":"Chipping Away: Assessing and Addressing the Labor Market Gap Facing the U.S. Semiconductor Industry","key":"ref2"},{"doi-asserted-by":"publisher","key":"ref3","DOI":"10.1109\/MSPEC.2023.10147079"},{"doi-asserted-by":"publisher","key":"ref4","DOI":"10.1002\/jee.20575"},{"volume-title":"Experiential Learning: Experience as the Source of Learning and Development","year":"1984","author":"Kolb","key":"ref5"},{"volume-title":"Center for Nanotechnology Education and Utilization, PennState","key":"ref6"}],"event":{"name":"2024 IEEE Frontiers in Education Conference (FIE)","start":{"date-parts":[[2024,10,13]]},"location":"Washington, DC, USA","end":{"date-parts":[[2024,10,16]]}},"container-title":["2024 IEEE Frontiers in Education Conference (FIE)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10892093\/10892810\/10893112.pdf?arnumber=10893112","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,2,27]],"date-time":"2025-02-27T09:41:06Z","timestamp":1740649266000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10893112\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,10,13]]},"references-count":6,"URL":"https:\/\/doi.org\/10.1109\/fie61694.2024.10893112","relation":{},"subject":[],"published":{"date-parts":[[2024,10,13]]}}}