{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,29]],"date-time":"2024-10-29T17:18:17Z","timestamp":1730222297567,"version":"3.28.0"},"reference-count":6,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2008]]},"DOI":"10.1109\/fpl.2008.4630045","type":"proceedings-article","created":{"date-parts":[[2008,9,26]],"date-time":"2008-09-26T15:16:55Z","timestamp":1222442215000},"page":"701-702","source":"Crossref","is-referenced-by-count":1,"title":["Thermal aware FPGA architectures and CAD"],"prefix":"10.1109","author":[{"given":"Shilpa","family":"Bhoj","sequence":"first","affiliation":[]}],"member":"263","reference":[{"year":"0","key":"3"},{"key":"2","article-title":"cell-level placement for improving substrate thermal distribution","volume":"19","author":"tsai","year":"2000","journal-title":"IEEE TCAD"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1109\/ICCD.2005.78"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2007.378190"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2005.857312"},{"year":"0","key":"4"}],"event":{"name":"2008 International Conference on Field Programmable Logic and Applications (FPL)","start":{"date-parts":[[2008,9,8]]},"location":"Heidelberg, Germany","end":{"date-parts":[[2008,9,10]]}},"container-title":["2008 International Conference on Field Programmable Logic and Applications"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/4625340\/4629890\/04630045.pdf?arnumber=4630045","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,17]],"date-time":"2017-03-17T15:31:39Z","timestamp":1489764699000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/4630045\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2008]]},"references-count":6,"URL":"https:\/\/doi.org\/10.1109\/fpl.2008.4630045","relation":{},"subject":[],"published":{"date-parts":[[2008]]}}}