{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,5]],"date-time":"2024-09-05T10:34:45Z","timestamp":1725532485865},"reference-count":10,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2016,10]]},"DOI":"10.1109\/gcce.2016.7800353","type":"proceedings-article","created":{"date-parts":[[2016,12,29]],"date-time":"2016-12-29T16:56:26Z","timestamp":1483030586000},"page":"1-2","source":"Crossref","is-referenced-by-count":1,"title":["A reconfigurable near-data systolic array accelerator for the three-dimensional DRAM systems"],"prefix":"10.1109","author":[{"given":"Shu-Yen","family":"Lin","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jin-Yi","family":"Lin","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Cheng-Hung","family":"Lin","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","first-page":"1","article-title":"DRAMA: An architecture for accelerated processing near memory","author":"farmahini-farahani","year":"2014","journal-title":"Computer Architecture Letters"},{"key":"ref3","article-title":"Thermal Issues of 3D ICs","author":"fukushima","year":"2007","journal-title":"Workshop on DFR"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/SIPS.2007.4387624"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/3DIC.2013.6702348"},{"key":"ref5","article-title":"3D-Stacked Memory-Side Acceleration: Accelerator and System Design","author":"guo","year":"2014","journal-title":"2nd Workshop on Near Data Processing (WoNDP)"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1145\/859618.859620"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/L-CA.2011.4"},{"journal-title":"Welcome to 3D Week Why is 3D important? Now? The memory wall heat and disposable sensors","year":"0","key":"ref2"},{"article-title":"VLSI Digital Signal Processing Systems: Design and Implementation","year":"1999","author":"parhi","key":"ref9"},{"journal-title":"Ahead of the curve straight to the future","year":"0","key":"ref1"}],"event":{"name":"2016 IEEE 5th Global Conference on Consumer Electronics","start":{"date-parts":[[2016,10,11]]},"location":"Kyoto, Japan","end":{"date-parts":[[2016,10,14]]}},"container-title":["2016 IEEE 5th Global Conference on Consumer Electronics"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7787085\/7800304\/07800353.pdf?arnumber=7800353","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,1,10]],"date-time":"2017-01-10T19:25:34Z","timestamp":1484076334000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7800353\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2016,10]]},"references-count":10,"URL":"https:\/\/doi.org\/10.1109\/gcce.2016.7800353","relation":{},"subject":[],"published":{"date-parts":[[2016,10]]}}}