{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,7,8]],"date-time":"2026-07-08T06:17:11Z","timestamp":1783491431546,"version":"3.55.0"},"reference-count":18,"publisher":"IEEE","license":[{"start":{"date-parts":[[2025,12,8]],"date-time":"2025-12-08T00:00:00Z","timestamp":1765152000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,12,8]],"date-time":"2025-12-08T00:00:00Z","timestamp":1765152000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2025,12,8]]},"DOI":"10.1109\/gcwkshps68340.2025.11591229","type":"proceedings-article","created":{"date-parts":[[2026,7,7]],"date-time":"2026-07-07T19:42:22Z","timestamp":1783453342000},"page":"92-97","source":"Crossref","is-referenced-by-count":0,"title":["Real-Time On-Device Machine Learning Model Adaptation: Pioneering Over-The-Air Prototyping Experiments Based on Beam Prediction"],"prefix":"10.1109","author":[{"given":"Qiaoyu","family":"Li","sequence":"first","affiliation":[{"name":"Qualcomm Wireless Communication Technologies (China) Limited,Wireless R&D Qualcomm Research,Beijing,P. R. China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Manish","family":"Rana","sequence":"additional","affiliation":[{"name":"Qualcomm Canada ULC,Markham,Canada"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Mariko","family":"Talsumi","sequence":"additional","affiliation":[{"name":"Qualcomm Canada ULC,Markham,Canada"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Armand","family":"Ahadi-Sarkani","sequence":"additional","affiliation":[{"name":"Qualcomm Technologies, Inc.,Wireless R&D Qualcomm Research,San Diego,CA,USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Amanjit","family":"Dhillon","sequence":"additional","affiliation":[{"name":"Qualcomm Canada ULC,Markham,Canada"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Arumugam","family":"Kannan","sequence":"additional","affiliation":[{"name":"Qualcomm Technologies, Inc.,Wireless R&D Qualcomm Research,San Diego,CA,USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Parag","family":"Kanade","sequence":"additional","affiliation":[{"name":"Qualcomm Technologies, Inc.,Wireless R&D Qualcomm Research,San Diego,CA,USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Serag","family":"Gadelrab","sequence":"additional","affiliation":[{"name":"Qualcomm Canada ULC,Markham,Canada"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Tao","family":"Luo","sequence":"additional","affiliation":[{"name":"Qualcomm Technologies, Inc.,Wireless R&D Qualcomm Research,San Diego,CA,USA"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TCCN.2022.3228536"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/LWC.2022.3202117"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/LWC.2024.3486543"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/LRA.2024.3416771"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/IROS58592.2024.10801427"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/LRA.2020.2974685"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1145\/3534678.3539293"},{"key":"ref8","volume-title":"New study item: study on artificial intelligence (AI)\/machine learning (ML) for NR air interface","year":"2021"},{"key":"ref9","volume-title":"New work item description on artificial intelligence (AI)\/machine learning (ML) for NR air interface","year":"2023"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TWC.2016.2520930"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/VTCFall.2019.8891363"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TVT.2021.3049380"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/GCWkshps56602.2022.10008553"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/JSAC.2023.3275613"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/IEEECONF60004.2024.10942671"},{"key":"ref16","journal-title":"Physical Layer Procedures for Data (Release-15)"},{"key":"ref17","journal-title":"3GPP RAN1 Chair\u2019s Notes, RAN1#118"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.48550\/ARXIV.1706.03762"}],"event":{"name":"2025 IEEE Globecom Workshops (GC Wkshps)","location":"Taipei, Taiwan","start":{"date-parts":[[2025,12,8]]},"end":{"date-parts":[[2025,12,12]]}},"container-title":["2025 IEEE Globecom Workshops (GC Wkshps)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/11589948\/11590845\/11591229.pdf?arnumber=11591229","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,7,8]],"date-time":"2026-07-08T05:46:19Z","timestamp":1783489579000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11591229\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,12,8]]},"references-count":18,"URL":"https:\/\/doi.org\/10.1109\/gcwkshps68340.2025.11591229","relation":{},"subject":[],"published":{"date-parts":[[2025,12,8]]}}}