{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,13]],"date-time":"2026-04-13T14:39:53Z","timestamp":1776091193216,"version":"3.50.1"},"reference-count":18,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2018,3]]},"DOI":"10.1109\/haptics.2018.8357160","type":"proceedings-article","created":{"date-parts":[[2018,5,10]],"date-time":"2018-05-10T23:12:15Z","timestamp":1525993935000},"page":"100-105","source":"Crossref","is-referenced-by-count":28,"title":["Development of a miniaturized thermal module designed for integration in a wearable haptic device"],"prefix":"10.1109","author":[{"given":"Massimiliano","family":"Gabardi","sequence":"first","affiliation":[]},{"given":"Daniele","family":"Leonardis","sequence":"additional","affiliation":[]},{"given":"Massimiliano","family":"Solazzi","sequence":"additional","affiliation":[]},{"given":"Antonio","family":"Frisoli","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/HAPTICS.2014.6775436"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1016\/j.sna.2015.10.048"},{"key":"ref12","first-page":"437","article-title":"A novel multimodal tactile module that can provide vibro-thermal feedback","author":"nakatani","year":"2016","journal-title":"International AsiaHaptics conference Springer"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TOH.2016.2640291"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TOH.2017.2689006"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/HAPTICS.2016.7463168"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1016\/j.pain.2004.12.014"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-642-31401-8_41"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TOH.2008.2"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.3758\/BF03193662"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ROBOT.2004.1308042"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/MHS.2003.1249925"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1162\/pres.1997.6.6.617"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1145\/1265957.1265962"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1162\/pres.17.1.29"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/IEMBS.2004.1403711"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1115\/1.2899574"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.3389\/frobt.2015.00025"}],"event":{"name":"2018 IEEE Haptics Symposium (HAPTICS)","location":"San Francisco, CA","start":{"date-parts":[[2018,3,25]]},"end":{"date-parts":[[2018,3,28]]}},"container-title":["2018 IEEE Haptics Symposium (HAPTICS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8354412\/8357134\/08357160.pdf?arnumber=8357160","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2018,5,29]],"date-time":"2018-05-29T00:45:19Z","timestamp":1527554719000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8357160\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2018,3]]},"references-count":18,"URL":"https:\/\/doi.org\/10.1109\/haptics.2018.8357160","relation":{},"subject":[],"published":{"date-parts":[[2018,3]]}}}