{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,8,27]],"date-time":"2025-08-27T00:19:39Z","timestamp":1756253979893,"version":"3.44.0"},"reference-count":0,"publisher":"IEEE","license":[{"start":{"date-parts":[[2022,8,21]],"date-time":"2022-08-21T00:00:00Z","timestamp":1661040000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,8,21]],"date-time":"2022-08-21T00:00:00Z","timestamp":1661040000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2022,8,21]]},"DOI":"10.1109\/hcs55958.2022.9895605","type":"proceedings-article","created":{"date-parts":[[2022,9,26]],"date-time":"2022-09-26T16:59:33Z","timestamp":1664211573000},"page":"1-25","source":"Crossref","is-referenced-by-count":0,"title":["DSPU: A 281.6mW Real-Time Deep Learning-Based Dense RGB-D Data Acquisition with Sensor Fusion and 3D Perception System-on-Chip"],"prefix":"10.1109","author":[{"given":"Dongseok","family":"Im","sequence":"first","affiliation":[{"name":"KAIST,Semiconductor System Lab., School of EE"}]},{"given":"Gwangtae","family":"Park","sequence":"additional","affiliation":[{"name":"KAIST,Semiconductor System Lab., School of EE"}]},{"given":"Zhiyong","family":"Li","sequence":"additional","affiliation":[{"name":"KAIST,Semiconductor System Lab., School of EE"}]},{"given":"Junha","family":"Ryu","sequence":"additional","affiliation":[{"name":"KAIST,Semiconductor System Lab., School of EE"}]},{"given":"Sanghoon","family":"Kang","sequence":"additional","affiliation":[{"name":"KAIST,Semiconductor System Lab., School of EE"}]},{"given":"Donghyeon","family":"Han","sequence":"additional","affiliation":[{"name":"KAIST,Semiconductor System Lab., School of EE"}]},{"given":"Jinsu","family":"Lee","sequence":"additional","affiliation":[{"name":"KAIST,Semiconductor System Lab., School of EE"}]},{"given":"Wonhoon","family":"Park","sequence":"additional","affiliation":[{"name":"KAIST,Semiconductor System Lab., School of EE"}]},{"given":"Hankyul","family":"Kown","sequence":"additional","affiliation":[{"name":"KAIST,Semiconductor System Lab., School of EE"}]},{"given":"Hoi-Jun","family":"Yoo","sequence":"additional","affiliation":[{"name":"KAIST,Semiconductor System Lab., School of EE"}]}],"member":"263","event":{"name":"2022 IEEE Hot Chips 34 Symposium (HCS)","start":{"date-parts":[[2022,8,21]]},"location":"Cupertino, CA, USA","end":{"date-parts":[[2022,8,23]]}},"container-title":["2022 IEEE Hot Chips 34 Symposium (HCS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9895464\/9895476\/09895605.pdf?arnumber=9895605","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,8,26]],"date-time":"2025-08-26T19:18:09Z","timestamp":1756235889000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9895605\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,8,21]]},"references-count":0,"URL":"https:\/\/doi.org\/10.1109\/hcs55958.2022.9895605","relation":{},"subject":[],"published":{"date-parts":[[2022,8,21]]}}}