{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,4]],"date-time":"2026-02-04T17:57:51Z","timestamp":1770227871769,"version":"3.49.0"},"reference-count":0,"publisher":"IEEE","license":[{"start":{"date-parts":[[2022,8,21]],"date-time":"2022-08-21T00:00:00Z","timestamp":1661040000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,8,21]],"date-time":"2022-08-21T00:00:00Z","timestamp":1661040000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2022,8,21]]},"DOI":"10.1109\/hcs55958.2022.9895633","type":"proceedings-article","created":{"date-parts":[[2022,9,26]],"date-time":"2022-09-26T16:59:33Z","timestamp":1664211573000},"page":"1-27","source":"Crossref","is-referenced-by-count":20,"title":["Scaling of Memory Performance and Capacity with CXL Memory Expander"],"prefix":"10.1109","author":[{"given":"S. J.","family":"Park","sequence":"first","affiliation":[{"name":"Samsung Electronics Co., Ltd."}]},{"given":"H.","family":"Kim","sequence":"additional","affiliation":[{"name":"Samsung Electronics Co., Ltd."}]},{"given":"K.-S.","family":"Kim","sequence":"additional","affiliation":[{"name":"Samsung Electronics Co., Ltd."}]},{"given":"J.","family":"So","sequence":"additional","affiliation":[{"name":"Samsung Electronics Co., Ltd."}]},{"given":"J.","family":"Ahn","sequence":"additional","affiliation":[{"name":"Samsung Electronics Co., Ltd."}]},{"given":"W.-J.","family":"Lee","sequence":"additional","affiliation":[{"name":"Samsung Electronics Co., Ltd."}]},{"given":"D.","family":"Kim","sequence":"additional","affiliation":[{"name":"Samsung Electronics Co., Ltd."}]},{"given":"Y.-J.","family":"Kim","sequence":"additional","affiliation":[{"name":"Samsung Electronics Co., Ltd."}]},{"given":"J.","family":"Seok","sequence":"additional","affiliation":[{"name":"Samsung Electronics Co., Ltd."}]},{"given":"J.-G.","family":"Lee","sequence":"additional","affiliation":[{"name":"Samsung Electronics Co., Ltd."}]},{"given":"H.-Y.","family":"Ryu","sequence":"additional","affiliation":[{"name":"Samsung Electronics Co., Ltd."}]},{"given":"C. Y.","family":"Lee","sequence":"additional","affiliation":[{"name":"Samsung Electronics Co., Ltd."}]},{"given":"J.","family":"Prout","sequence":"additional","affiliation":[{"name":"Samsung Electronics Co., Ltd."}]},{"given":"K.-C.","family":"Ryoo","sequence":"additional","affiliation":[{"name":"Samsung Electronics Co., Ltd."}]},{"given":"S.-J.","family":"Han","sequence":"additional","affiliation":[{"name":"Samsung Electronics Co., Ltd."}]},{"given":"M.-K.","family":"Kook","sequence":"additional","affiliation":[{"name":"Samsung Electronics Co., Ltd."}]},{"given":"J. S.","family":"Choi","sequence":"additional","affiliation":[{"name":"Samsung Electronics Co., Ltd."}]},{"given":"J.","family":"Gim","sequence":"additional","affiliation":[{"name":"Samsung Electronics Co., Ltd."}]},{"given":"Y. S.","family":"Ki","sequence":"additional","affiliation":[{"name":"Samsung Electronics Co., Ltd."}]},{"given":"S.","family":"Ryu","sequence":"additional","affiliation":[{"name":"Samsung Electronics Co., Ltd."}]},{"given":"C.","family":"Park","sequence":"additional","affiliation":[{"name":"Samsung Electronics Co., Ltd."}]},{"given":"D.-G.","family":"Lee","sequence":"additional","affiliation":[{"name":"Samsung Electronics Co., Ltd."}]},{"given":"J.","family":"Cho","sequence":"additional","affiliation":[{"name":"Samsung Electronics Co., Ltd."}]},{"given":"H.","family":"Song","sequence":"additional","affiliation":[{"name":"Samsung Electronics Co., Ltd."}]},{"given":"J. Y.","family":"Lee","sequence":"additional","affiliation":[{"name":"Samsung Electronics Co., Ltd."}]}],"member":"263","event":{"name":"2022 IEEE Hot Chips 34 Symposium (HCS)","location":"Cupertino, CA, USA","start":{"date-parts":[[2022,8,21]]},"end":{"date-parts":[[2022,8,23]]}},"container-title":["2022 IEEE Hot Chips 34 Symposium (HCS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9895464\/9895476\/09895633.pdf?arnumber=9895633","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,11,6]],"date-time":"2025-11-06T18:51:32Z","timestamp":1762455092000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9895633\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,8,21]]},"references-count":0,"URL":"https:\/\/doi.org\/10.1109\/hcs55958.2022.9895633","relation":{},"subject":[],"published":{"date-parts":[[2022,8,21]]}}}