{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,12,24]],"date-time":"2025-12-24T12:15:43Z","timestamp":1766578543621},"reference-count":0,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2016,8]]},"DOI":"10.1109\/hotchips.2016.7936211","type":"proceedings-article","created":{"date-parts":[[2017,6,1]],"date-time":"2017-06-01T16:22:12Z","timestamp":1496334132000},"page":"1-32","source":"Crossref","is-referenced-by-count":6,"title":["A 16nm 256-bit wide 89.6GByte\/s total bandwidth in-package interconnect with 0.3V swing and 0.062pJ\/bit power in InFO package"],"prefix":"10.1109","author":[{"family":"Mu-Shan Lin","sequence":"first","affiliation":[]},{"family":"Chien-Chun Tsai","sequence":"additional","affiliation":[]},{"family":"Cheng-Hsiang Hsieh","sequence":"additional","affiliation":[]},{"family":"Wen-Hung Huang","sequence":"additional","affiliation":[]},{"family":"Yu-Chi Chen","sequence":"additional","affiliation":[]},{"family":"Shu-Chun Yang","sequence":"additional","affiliation":[]},{"family":"Chin-Ming Fu","sequence":"additional","affiliation":[]},{"family":"Hao-Jie Zhan","sequence":"additional","affiliation":[]},{"family":"Jinn-Yeh Chien","sequence":"additional","affiliation":[]},{"family":"Shao-Yu Li","sequence":"additional","affiliation":[]},{"given":"Y.-H.","family":"Chen","sequence":"additional","affiliation":[]},{"given":"C.-C.","family":"Kuo","sequence":"additional","affiliation":[]},{"family":"Shih-Peng Tai","sequence":"additional","affiliation":[]},{"given":"Kazuyoshi","family":"Yamada","sequence":"additional","affiliation":[]}],"member":"263","event":{"name":"2016 IEEE Hot Chips 28 Symposium (HCS)","start":{"date-parts":[[2016,8,21]]},"location":"Cupertino, CA, USA","end":{"date-parts":[[2016,8,23]]}},"container-title":["2016 IEEE Hot Chips 28 Symposium (HCS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7932734\/7936168\/07936211.pdf?arnumber=7936211","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,1]],"date-time":"2017-06-01T16:22:16Z","timestamp":1496334136000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7936211\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2016,8]]},"references-count":0,"URL":"https:\/\/doi.org\/10.1109\/hotchips.2016.7936211","relation":{},"subject":[],"published":{"date-parts":[[2016,8]]}}}