{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,10,29]],"date-time":"2025-10-29T03:47:30Z","timestamp":1761709650832},"reference-count":0,"publisher":"IEEE","license":[{"start":{"date-parts":[[2019,8,1]],"date-time":"2019-08-01T00:00:00Z","timestamp":1564617600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2019,8,1]],"date-time":"2019-08-01T00:00:00Z","timestamp":1564617600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2019,8,1]],"date-time":"2019-08-01T00:00:00Z","timestamp":1564617600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2019,8]]},"DOI":"10.1109\/hotchips.2019.8875646","type":"proceedings-article","created":{"date-parts":[[2019,10,22]],"date-time":"2019-10-22T00:19:51Z","timestamp":1571703591000},"page":"1-22","source":"Crossref","is-referenced-by-count":4,"title":["Gen-Z Chipsetfor Exascale Fabrics"],"prefix":"10.1109","author":[{"given":"Patrick","family":"Knebel","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Dan","family":"Berkram","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Al","family":"Davis","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Darel","family":"Emmot","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Paolo","family":"Faraboschi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Gary","family":"Gostin","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","event":{"name":"2019 IEEE Hot Chips 31 Symposium (HCS)","start":{"date-parts":[[2019,8,18]]},"location":"Cupertino, CA, USA","end":{"date-parts":[[2019,8,20]]}},"container-title":["2019 IEEE Hot Chips 31 Symposium (HCS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8869546\/8875627\/08875646.pdf?arnumber=8875646","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,7,15]],"date-time":"2022-07-15T03:10:13Z","timestamp":1657854613000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8875646\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,8]]},"references-count":0,"URL":"https:\/\/doi.org\/10.1109\/hotchips.2019.8875646","relation":{},"subject":[],"published":{"date-parts":[[2019,8]]}}}