{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,23]],"date-time":"2024-10-23T08:31:25Z","timestamp":1729672285280,"version":"3.28.0"},"reference-count":10,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2016,7]]},"DOI":"10.1109\/hsi.2016.7529645","type":"proceedings-article","created":{"date-parts":[[2016,8,4]],"date-time":"2016-08-04T20:27:58Z","timestamp":1470342478000},"page":"284-288","source":"Crossref","is-referenced-by-count":2,"title":["Investigations of double layer UV-curing resin diamond wire saw"],"prefix":"10.1109","author":[{"given":"Chunyan","family":"Yao","sequence":"first","affiliation":[]},{"family":"Wei Zhang","sequence":"additional","affiliation":[]},{"family":"Tengwei Qiu","sequence":"additional","affiliation":[]},{"family":"Minghuan Wang","sequence":"additional","affiliation":[]},{"family":"Xuefeng Xu","sequence":"additional","affiliation":[]},{"given":"Wei","family":"Peng","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1016\/j.cirp.2013.03.122"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1016\/j.precisioneng.2015.08.008"},{"key":"ref10","first-page":"2148","article-title":"Research and application on the bonding mechanism of the Photosensitive resin blade","volume":"17","author":"peng","year":"2006","journal-title":"China Mechanical Engineering"},{"key":"ref6","first-page":"56","article-title":"Develop resin bonded diamond wire saw using UV curing resin","volume":"16","author":"toshiyuki","year":"2004","journal-title":"Jewellery Science and Technology"},{"article-title":"Research on manufacturing technology of heat-curing diamond wire saw","year":"2014","author":"gao","key":"ref5"},{"article-title":"Resin bonding wire saw","year":"2010","author":"ide","key":"ref8"},{"year":"1999","key":"ref7","article-title":"Wire saw and its manufacture"},{"key":"ref2","first-page":"1","author":"zhang","year":"2009","journal-title":"Silicon wafer processing"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1002\/jms.1730"},{"key":"ref1","first-page":"21","article-title":"Reaching a Kerf Loss Below 100?m by Optimizing the Relation Between Wire Thickness and Abrasive Size for Multi-Wire Sawing","author":"schumann","year":"2009","journal-title":"Proceedings of the 24th European PV Solar Energy Conference and Exhibition"}],"event":{"name":"2016 9th International Conference on Human System Interactions (HSI)","start":{"date-parts":[[2016,7,6]]},"location":"Portsmouth, United Kingdom","end":{"date-parts":[[2016,7,8]]}},"container-title":["2016 9th International Conference on Human System Interactions (HSI)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7523844\/7529596\/07529645.pdf?arnumber=7529645","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2016,9,26]],"date-time":"2016-09-26T01:59:49Z","timestamp":1474855189000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7529645\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2016,7]]},"references-count":10,"URL":"https:\/\/doi.org\/10.1109\/hsi.2016.7529645","relation":{},"subject":[],"published":{"date-parts":[[2016,7]]}}}