{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,25]],"date-time":"2026-02-25T17:45:01Z","timestamp":1772041501651,"version":"3.50.1"},"reference-count":42,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2018,4]]},"DOI":"10.1109\/hst.2018.8383917","type":"proceedings-article","created":{"date-parts":[[2018,6,14]],"date-time":"2018-06-14T23:36:11Z","timestamp":1529019371000},"page":"209-214","source":"Crossref","is-referenced-by-count":28,"title":["Robust, low-cost, and accurate detection of recycled ICs using digital signatures"],"prefix":"10.1109","author":[{"given":"Mahabubul","family":"Alam","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Sreeja","family":"Chowdhury","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Mark M.","family":"Tehranipoor","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ujjwal","family":"Guin","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref39","year":"0","journal-title":"Temptronic ATS-605 ThermoStream Thermal Inducing System ?20 to +225C"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1145\/2228360.2228486"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2006.320885"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2004.03.019"},{"key":"ref31","year":"2008","journal-title":"The Keyed-Hash Message Authentication Code (HMAC) FIPS PUB 198"},{"key":"ref30","year":"2015","journal-title":"FIPS 180-4 Secure Hash Standard (SHS)"},{"key":"ref37","first-page":"176","article-title":"Reliability challenges for 45nm and beyond","author":"mcpherson","year":"2006","journal-title":"ACM\/IEEE Design Automation Conference"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2006.876041"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1109\/T-ED.1985.21953"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/RELPHY.2002.996644"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/DFT.2012.6378191"},{"key":"ref40","year":"0","journal-title":"Nexys 4 DDR Artix-7 FPGA Trainer Board"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/DFT.2014.6962099"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/HST.2016.7495581"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1145\/2228360.2228486"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2013.2264063"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1145\/2593069.2593157"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2015.2466551"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2015.7372562"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.4271\/2012-01-2104"},{"key":"ref19","year":"2012","journal-title":"Public Comments-DNA Authentication Marking on Items in FSC5962"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1145\/359340.359342"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1007\/s10836-013-5430-8"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2007.4405850"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2014.2332291"},{"key":"ref6","year":"2009","journal-title":"Counterfeit Electronic Parts Avoidance Detection Mitigation and Disposition"},{"key":"ref29","author":"hankerson","year":"2006","journal-title":"Guide to Elliptic Curve Cryptography"},{"key":"ref5","year":"2016","journal-title":"Test Methods Standard General Requirements Suspect\/Counterfeit Electrical Electronic and Electromechanical Parts"},{"key":"ref8","year":"2017","journal-title":"Acceptability of Electronic Components Distributed in the Open Market"},{"key":"ref7","year":"2011","journal-title":"Certification for counterfeit components avoidance program"},{"key":"ref2","doi-asserted-by":"crossref","DOI":"10.1007\/978-3-319-11824-6","author":"tehranipoor","year":"2015","journal-title":"Counterfeit Integrated Circuits - Detection and Avoidance"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/DFT.2012.6378192"},{"key":"ref1","author":"isuppli","year":"2011","journal-title":"Top 5 Most Counterfeited Parts Represent A $169 Billion Potential Challenge for Global Semiconductor Market"},{"key":"ref20","year":"2013","journal-title":"FIPS 186-4 Digital Signature Standard (DSS)"},{"key":"ref22","author":"sugasawara","year":"2000","journal-title":"Process monitor circuitry for integrated circuits"},{"key":"ref21","author":"lee","year":"1996","journal-title":"Process monitor for cmos integrated circuits"},{"key":"ref42","doi-asserted-by":"publisher","DOI":"10.1145\/2508859.2516717"},{"key":"ref24","first-page":"1","year":"2013","journal-title":"IEEE Standard for Test Access Port and Boundary-Scan Architecture"},{"key":"ref41","doi-asserted-by":"publisher","DOI":"10.1109\/ESSCIRC.2012.6341361"},{"key":"ref23","author":"bach","year":"2003","journal-title":"Process monitor with statistically selected ring oscillator"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/IEMT.1999.804850"},{"key":"ref25","author":"eklow","year":"2006","journal-title":"ECID vs Device ID"}],"event":{"name":"2018 IEEE International Symposium on Hardware Oriented Security and Trust (HOST)","location":"Washington, DC","start":{"date-parts":[[2018,4,30]]},"end":{"date-parts":[[2018,5,4]]}},"container-title":["2018 IEEE International Symposium on Hardware Oriented Security and Trust (HOST)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8369415\/8383882\/08383917.pdf?arnumber=8383917","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,9,3]],"date-time":"2023-09-03T05:43:36Z","timestamp":1693719816000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8383917\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2018,4]]},"references-count":42,"URL":"https:\/\/doi.org\/10.1109\/hst.2018.8383917","relation":{},"subject":[],"published":{"date-parts":[[2018,4]]}}}