{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,22]],"date-time":"2024-10-22T21:07:41Z","timestamp":1729631261359,"version":"3.28.0"},"reference-count":13,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2016,5]]},"DOI":"10.1109\/i2mtc.2016.7520497","type":"proceedings-article","created":{"date-parts":[[2016,7,27]],"date-time":"2016-07-27T14:33:39Z","timestamp":1469630019000},"page":"1-6","source":"Crossref","is-referenced-by-count":1,"title":["Real-time image data acquisition and inspection system for integrated circuit wafer after sawing process"],"prefix":"10.1109","author":[{"given":"Chun-Fu","family":"Lin","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hong-Ren","family":"Fang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jyh-Rou","family":"Sze","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Sheng-Fuu","family":"Lin","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Chi-Hung","family":"Hwang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","first-page":"260","article-title":"A neural-network approach for semiconductor wafer post-sawing inspection","volume":"2","author":"su","year":"2002","journal-title":"IEEE Trans Semicond Manuf"},{"doi-asserted-by":"publisher","key":"ref11","DOI":"10.1016\/S0166-3615(99)00009-3"},{"doi-asserted-by":"publisher","key":"ref12","DOI":"10.1016\/j.mejo.2005.07.018"},{"key":"ref13","article-title":"Automated Optical Inspection for Die Prep","author":"mei","year":"2012","journal-title":"IEEE ASMC"},{"doi-asserted-by":"publisher","key":"ref4","DOI":"10.1109\/66.536115"},{"doi-asserted-by":"publisher","key":"ref3","DOI":"10.1109\/66.744513"},{"doi-asserted-by":"publisher","key":"ref6","DOI":"10.1109\/EOSESD.2007.4401754"},{"year":"2000","author":"xiao","journal-title":"Introduction to Semiconductor Manufacturing Technology","key":"ref5"},{"doi-asserted-by":"publisher","key":"ref8","DOI":"10.1109\/66.857947"},{"key":"ref7","doi-asserted-by":"crossref","DOI":"10.1201\/9781420059922","article-title":"Three-step approach for wafer sawing lane inspection","volume":"11","author":"wang","year":"2009","journal-title":"SPIE Optical Engineering"},{"doi-asserted-by":"publisher","key":"ref2","DOI":"10.1109\/66.382274"},{"doi-asserted-by":"publisher","key":"ref1","DOI":"10.1016\/S0360-8352(99)00151-5"},{"doi-asserted-by":"publisher","key":"ref9","DOI":"10.1109\/33.232061"}],"event":{"name":"2016 IEEE International Instrumentation and Measurement Technology Conference (I2MTC)","start":{"date-parts":[[2016,5,23]]},"location":"Taipei, Taiwan","end":{"date-parts":[[2016,5,26]]}},"container-title":["2016 IEEE International Instrumentation and Measurement Technology Conference Proceedings"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7508333\/7520318\/07520497.pdf?arnumber=7520497","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,24]],"date-time":"2017-06-24T15:20:53Z","timestamp":1498317653000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7520497\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2016,5]]},"references-count":13,"URL":"https:\/\/doi.org\/10.1109\/i2mtc.2016.7520497","relation":{},"subject":[],"published":{"date-parts":[[2016,5]]}}}