{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,8,2]],"date-time":"2025-08-02T16:19:01Z","timestamp":1754151541007,"version":"3.41.2"},"reference-count":20,"publisher":"IEEE","license":[{"start":{"date-parts":[[2025,5,19]],"date-time":"2025-05-19T00:00:00Z","timestamp":1747612800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,5,19]],"date-time":"2025-05-19T00:00:00Z","timestamp":1747612800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2025,5,19]]},"DOI":"10.1109\/i2mtc62753.2025.11078982","type":"proceedings-article","created":{"date-parts":[[2025,7,18]],"date-time":"2025-07-18T17:42:33Z","timestamp":1752860553000},"page":"1-6","source":"Crossref","is-referenced-by-count":0,"title":["Compensation of thermal drifts on MEMS Inertial Measurement Unit using package underfilling"],"prefix":"10.1109","author":[{"given":"Gabriele","family":"Patrizi","sequence":"first","affiliation":[{"name":"Univeristy of Florence,Department of Information Engineering,Florence,Italy,50139"}]},{"given":"Marco","family":"Carrat\u00f9","sequence":"additional","affiliation":[{"name":"University of Salerno,Department of Industrial Engineering,Fisciano,Italy,84084"}]},{"given":"Karsten","family":"Meier","sequence":"additional","affiliation":[{"name":"Technische Universität Dresden,Inst. of Electronic Packaging Technology,Dresden,Germany,01069"}]},{"given":"Paolo","family":"Sommella","sequence":"additional","affiliation":[{"name":"University of Salerno,Department of Industrial Engineering,Fisciano,Italy,84084"}]},{"given":"Antonio","family":"Pietrosanto","sequence":"additional","affiliation":[{"name":"University of Salerno,Department of Industrial Engineering,Fisciano,Italy,84084"}]},{"given":"Karlheinz","family":"Bock","sequence":"additional","affiliation":[{"name":"Technische Universität Dresden,Inst. of Electronic Packaging Technology,Dresden,Germany,01069"}]},{"given":"Lorenzo","family":"Ciani","sequence":"additional","affiliation":[{"name":"Univeristy of Florence,Department of Information Engineering,Florence,Italy,50139"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1016\/b978-0-44-318542-7.00014-2"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/i2mtc43012.2020.9129263"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/tim.2022.3160538"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/tim.2023.3301860"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1016\/j.ymssp.2015.11.004"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1088\/1681-7575\/ad1692"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/tim.2022.3216400"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.21014\/tc10-2022.010"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1016\/j.measurement.2023.114001"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1016\/j.sna.2020.112393"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.3390\/mi15070835"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.3390\/mi15050609"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1016\/j.measurement.2023.113168"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.3390\/mi13060879"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/eurosime56861.2023.10100809"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/tcpmt.2024.3409753"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1016\/b978-0-8155-1576-0.50007-3"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/tim.2024.3400332"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2022.114731"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/estc55720.2022.9939434"}],"event":{"name":"2025 IEEE International Instrumentation and Measurement Technology Conference (I2MTC)","location":"Chemnitz, Germany","start":{"date-parts":[[2025,5,19]]},"end":{"date-parts":[[2025,5,22]]}},"container-title":["2025 IEEE International Instrumentation and Measurement Technology Conference (I2MTC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/11078887\/11078930\/11078982.pdf?arnumber=11078982","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,7,19]],"date-time":"2025-07-19T05:03:47Z","timestamp":1752901427000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11078982\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,5,19]]},"references-count":20,"URL":"https:\/\/doi.org\/10.1109\/i2mtc62753.2025.11078982","relation":{},"subject":[],"published":{"date-parts":[[2025,5,19]]}}}