{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,13]],"date-time":"2026-02-13T04:40:42Z","timestamp":1770957642714,"version":"3.50.1"},"reference-count":23,"publisher":"IEEE","license":[{"start":{"date-parts":[[2019,9,1]],"date-time":"2019-09-01T00:00:00Z","timestamp":1567296000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2019,9,1]],"date-time":"2019-09-01T00:00:00Z","timestamp":1567296000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2019,9,1]],"date-time":"2019-09-01T00:00:00Z","timestamp":1567296000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2019,9]]},"DOI":"10.1109\/ias.2019.8911921","type":"proceedings-article","created":{"date-parts":[[2019,11,29]],"date-time":"2019-11-29T09:59:46Z","timestamp":1575021586000},"page":"1-7","source":"Crossref","is-referenced-by-count":2,"title":["An Assessment of Immersion Cooling for Power Electronics: an Oil Volume Case Study"],"prefix":"10.1109","author":[{"given":"Igor A.","family":"Pires","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Rafael A.","family":"Silva","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Iago T.","family":"O. Pereira","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Osvane A.","family":"Faria","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Thales A.","family":"C. Maia","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Braz J.","family":"Cardoso Filho","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1115\/IMECE2016-67320"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/ITHERM.2016.7517566"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TIA.2019.2915276"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1016\/0026-2714(73)90462-9"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1007\/978-94-011-1090-7_36"},{"key":"ref15","doi-asserted-by":"crossref","first-page":"34","DOI":"10.1016\/j.microrel.2017.02.016","article-title":"Experimental and numerical study of 3D stacked dies under forced air cooling and water immersion cooling","volume":"74","author":"delong","year":"2017","journal-title":"Microelectronics Reliability"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1016\/j.ifacol.2016.12.070"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/STHERM.2010.5444305"},{"key":"ref18","article-title":"Immersed Cooling of Electronics","author":"axel","year":"2016","journal-title":"Master of Science Thesis"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1007\/978-94-011-1090-7_23"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/IAS.1998.730129"},{"key":"ref3","first-page":"3","article-title":"Methods of calculation of load modes of roughing stand electric drives of wide-strip hot rolling mill","author":"radionov","year":"2016","journal-title":"13th International Scientific-Technical Conference on Actual Problems of Electronics Instrument Engineering"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/07IAS.2007.22"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/MIAS.2016.2600690"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2010.2049864"},{"key":"ref7","first-page":"6","article-title":"Advanced Cooling for Power Electronics","author":"kang","year":"2012","journal-title":"7th International Conference on Integrated Power Electronics Systems"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TIA.2013.2282762"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TIA.2017.2731964"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2015.2513433"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1016\/0017-9310(91)90145-5"},{"key":"ref22","first-page":"277","article-title":"Optimal geometry of convection cooled electronic packages","author":"adrian","year":"1994","journal-title":"Cooling of Electronic Systems Springer Dordrecht"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1016\/S0017-9310(98)00379-2"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2015.2452262"}],"event":{"name":"2019 IEEE Industry Applications Society Annual Meeting","location":"Baltimore, MD, USA","start":{"date-parts":[[2019,9,29]]},"end":{"date-parts":[[2019,10,3]]}},"container-title":["2019 IEEE Industry Applications Society Annual Meeting"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8894477\/8911839\/08911921.pdf?arnumber=8911921","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,7,15]],"date-time":"2022-07-15T03:14:01Z","timestamp":1657854841000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8911921\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,9]]},"references-count":23,"URL":"https:\/\/doi.org\/10.1109\/ias.2019.8911921","relation":{},"subject":[],"published":{"date-parts":[[2019,9]]}}}