{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,2]],"date-time":"2026-04-02T15:33:13Z","timestamp":1775143993012,"version":"3.50.1"},"reference-count":18,"publisher":"IEEE","license":[{"start":{"date-parts":[[2025,4,6]],"date-time":"2025-04-06T00:00:00Z","timestamp":1743897600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,4,6]],"date-time":"2025-04-06T00:00:00Z","timestamp":1743897600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2025,4,6]]},"DOI":"10.1109\/icassp49660.2025.10887851","type":"proceedings-article","created":{"date-parts":[[2025,3,12]],"date-time":"2025-03-12T17:15:02Z","timestamp":1741799702000},"page":"1-5","source":"Crossref","is-referenced-by-count":1,"title":["A Near-Field 3D Parameter Estimation Method Based on a Symmetric Enhanced Nested Array"],"prefix":"10.1109","author":[{"given":"Linke","family":"Yu","sequence":"first","affiliation":[{"name":"Ningbo University,Faculty of Electrical Engineering and Computer Science,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hua","family":"Chen","sequence":"additional","affiliation":[{"name":"Ningbo University,Faculty of Electrical Engineering and Computer Science,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Dingfan","family":"Xue","sequence":"additional","affiliation":[{"name":"Ningbo University,Faculty of Electrical Engineering and Computer Science,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Wei","family":"Liu","sequence":"additional","affiliation":[{"name":"The Hong Kong Polytechnic University,Department of Electrical and Electronic Engineering,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ye","family":"Tian","sequence":"additional","affiliation":[{"name":"Ningbo University,Faculty of Electrical Engineering and Computer Science,China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Gang","family":"Wang","sequence":"additional","affiliation":[{"name":"Ningbo University,Faculty of Electrical Engineering and Computer Science,China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/WCNC57260.2024.10571066"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/RadarConf2458775.2024.10549360"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2021.3059157"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ICCSP.2016.7754416"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TSP.2011.2180902"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TSP.2009.2029723"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/LSP.2006.888390"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/LAWP.2015.2399534"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1016\/j.dsp.2020.102784"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ICASSP40776.2020.9052922"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TAP.2019.2925199"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ICSPCC55723.2022.9984352"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TVT.2020.2998128"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TVT.2020.2985903"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TAES.2022.3164864"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1016\/S0165-1684(97)00206-5"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/JSTSP.2024.3400046"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TSP.2014.2339792"}],"event":{"name":"ICASSP 2025 - 2025 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP)","location":"Hyderabad, India","start":{"date-parts":[[2025,4,6]]},"end":{"date-parts":[[2025,4,11]]}},"container-title":["ICASSP 2025 - 2025 IEEE International Conference on Acoustics, Speech and Signal Processing (ICASSP)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10887540\/10887541\/10887851.pdf?arnumber=10887851","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,3,25]],"date-time":"2026-03-25T05:26:23Z","timestamp":1774416383000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10887851\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,4,6]]},"references-count":18,"URL":"https:\/\/doi.org\/10.1109\/icassp49660.2025.10887851","relation":{},"subject":[],"published":{"date-parts":[[2025,4,6]]}}}