{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,6]],"date-time":"2024-09-06T08:50:01Z","timestamp":1725612601883},"reference-count":17,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"DOI":"10.1109\/iccad.2005.1560145","type":"proceedings-article","created":{"date-parts":[[2005,12,22]],"date-time":"2005-12-22T12:52:37Z","timestamp":1135255957000},"page":"639-644","source":"Crossref","is-referenced-by-count":8,"title":["Fast thermal simulation for architecture level dynamic thermal management"],"prefix":"10.1109","author":[{"family":"Pu Liu","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Zhenyu Qi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Hang Li","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Lingling Jin","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Wei Wu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Sheldon X.-D. Tan","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Jun Yang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"17","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2005.1466136"},{"key":"15","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2002.804385"},{"key":"16","first-page":"357","article-title":"Spice-compatible thermal simulation with lumped circuit modeling for thermal reliability analysis based on model reduction","year":"2004","journal-title":"Proc Int Symp Quality Electronic Design (ISQED)"},{"journal-title":"University of Virginia Dept of Computer Science Technicial Report CS-2003-08","article-title":"Temperature aware microarchitecture: Extended discussion and results","year":"2003","key":"13"},{"key":"14","article-title":"Fast thermal analysis for vlsi circuits via semi-analytical green's function in multi-layer materials","author":"wang","year":"2004","journal-title":"Proc IEEE Int Symp On Circuits and Systems (ISCAS)"},{"key":"11","doi-asserted-by":"publisher","DOI":"10.1145\/859654.859657"},{"key":"12","doi-asserted-by":"crossref","first-page":"2","DOI":"10.1145\/871656.859620","article-title":"Temperature aware microarchitecture","author":"skadron","year":"2003","journal-title":"Proc IEEE International Symposium on Computer Architecture (ISCA)"},{"key":"3","doi-asserted-by":"publisher","DOI":"10.1109\/HPCA.2001.903261"},{"journal-title":"International Technology Roadmap for Semiconductors(itrs) 2004 Update","year":"2001","key":"2"},{"year":"0","key":"1"},{"key":"10","doi-asserted-by":"publisher","DOI":"10.1109\/MM.2003.1261391"},{"key":"7","first-page":"199","article-title":"Constricting\/spreading resistance model for electronics packaging","author":"lee","year":"1995","journal-title":"Proc ASME\/JSME Thermal Engineering Conference"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2002.1167618"},{"key":"5","first-page":"878","article-title":"Compact thermal modeling for temperature-aware design","author":"wei huang","year":"2004","journal-title":"Proceedings 41st Design Automation Conference 2004 DAC"},{"journal-title":"Electrothermal Analysis of VLSI Systems","year":"2000","author":"cheng","key":"4"},{"key":"9","doi-asserted-by":"publisher","DOI":"10.1109\/PACT.2001.953283"},{"key":"8","doi-asserted-by":"publisher","DOI":"10.1109\/43.45867"}],"event":{"name":"ICCAD-2005. IEEE\/ACM International Conference on Computer-Aided Design, 2005.","location":"San Jose, CA"},"container-title":["ICCAD-2005. IEEE\/ACM International Conference on Computer-Aided Design, 2005."],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/10431\/33130\/01560145.pdf?arnumber=1560145","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,16]],"date-time":"2017-06-16T21:55:34Z","timestamp":1497650134000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/1560145\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[null]]},"references-count":17,"URL":"https:\/\/doi.org\/10.1109\/iccad.2005.1560145","relation":{},"subject":[]}}