{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,29]],"date-time":"2026-03-29T16:28:52Z","timestamp":1774801732440,"version":"3.50.1"},"reference-count":20,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2010,11]]},"DOI":"10.1109\/iccad.2010.5653753","type":"proceedings-article","created":{"date-parts":[[2010,12,10]],"date-time":"2010-12-10T22:29:13Z","timestamp":1292020153000},"page":"471-476","source":"Crossref","is-referenced-by-count":52,"title":["Cost-effective integration of three-dimensional (3D) ICs emphasizing testing cost analysis"],"prefix":"10.1109","author":[{"given":"Yibo","family":"Chen","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Dimin","family":"Niu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yuan","family":"Xie","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Krishnendu","family":"Chakrabarty","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"19","doi-asserted-by":"publisher","DOI":"10.1109\/66.56568"},{"key":"17","doi-asserted-by":"publisher","DOI":"10.1109\/TC.1981.1675742"},{"key":"18","doi-asserted-by":"publisher","DOI":"10.1109\/PROC.1964.3442"},{"key":"15","doi-asserted-by":"publisher","DOI":"10.1109\/54.980051"},{"key":"16","doi-asserted-by":"publisher","DOI":"10.1109\/MDT.2009.125"},{"key":"13","doi-asserted-by":"publisher","DOI":"10.1109\/ATS.2009.42"},{"key":"14","doi-asserted-by":"publisher","DOI":"10.1109\/3DIC.2009.5306569"},{"key":"11","doi-asserted-by":"publisher","DOI":"10.1145\/1687399.1687433"},{"key":"12","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2009.2017643"},{"key":"3","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2009.4796486"},{"key":"20","doi-asserted-by":"crossref","DOI":"10.1117\/12.845747","article-title":"3D integration opportunities, issues, and solutions: A designers perspective","author":"kwai","year":"2009","journal-title":"Proc SPIE Lithography Asia"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1145\/1148015.1148016"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1109\/MDT.2005.136"},{"key":"10","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2009.5355573"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.1109\/ISVLSI.2009.48"},{"key":"6","first-page":"1237","volume":"28","author":"weerasekera","year":"2009","journal-title":"Twodimensional and Three-dimensional Integration of Heterogeneous Electronic Systems under Cost Performance and Technological Constraints"},{"key":"5","first-page":"220","article-title":"Strategies for improving the parametric yield and profits of 3D ICs","author":"ferri","year":"2007","journal-title":"ICCAD"},{"key":"4","first-page":"357","article-title":"Yield, and cost modeling for 3D chip stack technologies","author":"mereieri","year":"2006","journal-title":"Proc IEEE Custom Integrated Circuits Conf (CICC)"},{"key":"9","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2008.2007473"},{"key":"8","doi-asserted-by":"publisher","DOI":"10.1109\/ISQED.2009.4810301"}],"event":{"name":"2010 IEEE\/ACM International Conference on Computer-Aided Design (ICCAD)","location":"San Jose, CA, USA","start":{"date-parts":[[2010,11,7]]},"end":{"date-parts":[[2010,11,11]]}},"container-title":["2010 IEEE\/ACM International Conference on Computer-Aided Design (ICCAD)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/5638200\/5648785\/05653753.pdf?arnumber=5653753","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,19]],"date-time":"2017-06-19T13:08:12Z","timestamp":1497877692000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/5653753\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2010,11]]},"references-count":20,"URL":"https:\/\/doi.org\/10.1109\/iccad.2010.5653753","relation":{},"subject":[],"published":{"date-parts":[[2010,11]]}}}