{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,30]],"date-time":"2026-04-30T23:20:07Z","timestamp":1777591207139,"version":"3.51.4"},"reference-count":21,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2013,11]]},"DOI":"10.1109\/iccad.2013.6691125","type":"proceedings-article","created":{"date-parts":[[2014,3,7]],"date-time":"2014-03-07T22:22:41Z","timestamp":1394230961000},"page":"242-247","source":"Crossref","is-referenced-by-count":43,"title":["Dynamic thermal management in mobile devices considering the thermal coupling between battery and application processor"],"prefix":"10.1109","author":[{"given":"Qing","family":"Xie","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jaemin","family":"Kim","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yanzhi","family":"Wang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Donghwa","family":"Shin","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Naehyuck","family":"Chang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Massoud","family":"Pedram","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"19","year":"0","journal-title":"Nexus S Specifications"},{"key":"17","year":"0","journal-title":"OMAP4460 Multimedia Device Data Manual"},{"key":"18","doi-asserted-by":"publisher","DOI":"10.1145\/1289881.1289925"},{"key":"15","doi-asserted-by":"publisher","DOI":"10.1109\/TEC.2006.874229"},{"key":"16","article-title":"Batterysupercapacitor hybrid system for high-rate pulsed load applications","author":"shin","year":"2011","journal-title":"DATE"},{"key":"13","doi-asserted-by":"publisher","DOI":"10.7873\/DATE.2013.254"},{"key":"14","article-title":"Thermal behavior of small lithium-ion battery during rapid charge and discharge cycles","author":"onda","year":"2010","journal-title":"J of Power Sources"},{"key":"11","article-title":"Temperature and supply voltage aware performance and power modeling at microarchitecture level","author":"liao","year":"2005","journal-title":"IEEE T on CAD"},{"key":"12","article-title":"Energy-optimal dynamic thermal management: Computation and cooling power cooptimization","author":"shin","year":"2010","journal-title":"IEEE T on Industrial Informatics"},{"key":"21","year":"0","journal-title":"StabilityTest v2 7"},{"key":"3","year":"0","journal-title":"Failure Mechanisms and Models for Semiconductor Devices"},{"key":"20","year":"0","journal-title":"TC1047AVNB Thermal Sensor"},{"key":"2","author":"wang","year":"2007","journal-title":"Compact Modeling and Simulation of Circuit Reliability for 65-nm Cmos Technology"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2006.879797"},{"key":"10","doi-asserted-by":"publisher","DOI":"10.1145\/2024724.2024746"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.1145\/782814.782831"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2012.2235126"},{"key":"5","author":"skadron","year":"2004","journal-title":"Temperature-aware Microarchitecture Modeling and Implementation"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1109\/HPCA.2001.903261"},{"key":"9","author":"lee","year":"2008","journal-title":"Gop-level Dynamic Thermal Management in Mpeg-2 Decoding"},{"key":"8","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2008.4681582"}],"event":{"name":"2013 IEEE\/ACM International Conference on Computer-Aided Design (ICCAD)","location":"San Jose, CA","start":{"date-parts":[[2013,11,18]]},"end":{"date-parts":[[2013,11,21]]}},"container-title":["2013 IEEE\/ACM International Conference on Computer-Aided Design (ICCAD)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6679730\/6691081\/06691125.pdf?arnumber=6691125","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,23]],"date-time":"2017-03-23T00:56:19Z","timestamp":1490230579000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6691125\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2013,11]]},"references-count":21,"URL":"https:\/\/doi.org\/10.1109\/iccad.2013.6691125","relation":{},"subject":[],"published":{"date-parts":[[2013,11]]}}}