{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,6]],"date-time":"2024-09-06T09:21:14Z","timestamp":1725614474580},"reference-count":13,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2013,11]]},"DOI":"10.1109\/iccad.2013.6691145","type":"proceedings-article","created":{"date-parts":[[2014,3,7]],"date-time":"2014-03-07T17:22:41Z","timestamp":1394212961000},"page":"371-378","source":"Crossref","is-referenced-by-count":1,"title":["Novel crack sensor for TSV-based 3D integrated circuits: Design and deployment perspectives"],"prefix":"10.1109","author":[{"given":"Chun","family":"Zhang","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Moongon","family":"Jung","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Sung Kyu","family":"Lim","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yiyu","family":"Shi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"13","doi-asserted-by":"publisher","DOI":"10.1109\/ITHERM.2010.5501279"},{"key":"11","doi-asserted-by":"publisher","DOI":"10.1145\/2451916.2451922"},{"key":"12","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2009.5074155"},{"key":"3","doi-asserted-by":"publisher","DOI":"10.1109\/ESTC.2006.280064"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1109\/ESimE.2012.6191794"},{"year":"0","key":"1"},{"key":"10","doi-asserted-by":"publisher","DOI":"10.1145\/1629911.1630044"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2012.6176969"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2012.2188400"},{"key":"5","first-page":"563","article-title":"Full-chip through-silicon-via interfacial crack analysis and optimization for 3D IC","author":"jung","year":"2010","journal-title":"Proc of Intl Conf on Computer-Aided Design"},{"key":"4","first-page":"117","article-title":"Mechanical strength of silicon wafers and its modelling","author":"coletti","year":"2005","journal-title":"Proc of Workshop on Crystalline Silicon Solar Cells and Modules Materials and Processes"},{"key":"9","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2009.5074079"},{"key":"8","article-title":"Failure mechanisms and optimum design for electroplated copper through-silicon vias (TSVs)","author":"liu","year":"2009","journal-title":"Proc Electronic Components and Technology Conf"}],"event":{"name":"2013 IEEE\/ACM International Conference on Computer-Aided Design (ICCAD)","start":{"date-parts":[[2013,11,18]]},"location":"San Jose, CA","end":{"date-parts":[[2013,11,21]]}},"container-title":["2013 IEEE\/ACM International Conference on Computer-Aided Design (ICCAD)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6679730\/6691081\/06691145.pdf?arnumber=6691145","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,22]],"date-time":"2017-03-22T20:49:11Z","timestamp":1490215751000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6691145\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2013,11]]},"references-count":13,"URL":"https:\/\/doi.org\/10.1109\/iccad.2013.6691145","relation":{},"subject":[],"published":{"date-parts":[[2013,11]]}}}