{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,7]],"date-time":"2026-03-07T18:31:58Z","timestamp":1772908318647,"version":"3.50.1"},"reference-count":12,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2014,11]]},"DOI":"10.1109\/iccad.2014.7001406","type":"proceedings-article","created":{"date-parts":[[2015,1,13]],"date-time":"2015-01-13T15:11:15Z","timestamp":1421161875000},"page":"565-572","source":"Crossref","is-referenced-by-count":20,"title":["Full chip impact study of power delivery network designs in monolithic 3D ICs"],"prefix":"10.1109","author":[{"given":"Sandeep Kumar","family":"Samal","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Kambiz","family":"Samadi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Pratyush","family":"Kamal","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yang","family":"Du","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Sung Kyu","family":"Lim","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2012.6479040"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2013.6509679"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2010.5419899"},{"key":"ref10","year":"0"},{"key":"ref5","first-page":"442","article-title":"CPDI: Cross-Power-Domain Interface Circuit Design in Monolithic 3D Technology","author":"xie","year":"2013","journal-title":"International Symposium on Quality Electronic Design"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1145\/2560519.2560531"},{"key":"ref12","year":"0","journal-title":"One-to-one interaction with industry partners"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/3DIC.2009.5306539"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1145\/2451916.2451922"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1145\/2463209.2488863"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/JETCAS.2012.2223593"},{"key":"ref9","year":"0","journal-title":"OpenSPARC T2"}],"event":{"name":"2014 IEEE\/ACM International Conference on Computer-Aided Design (ICCAD)","location":"San Jose, CA, USA","start":{"date-parts":[[2014,11,2]]},"end":{"date-parts":[[2014,11,6]]}},"container-title":["2014 IEEE\/ACM International Conference on Computer-Aided Design (ICCAD)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6991350\/7001313\/07001406.pdf?arnumber=7001406","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,24]],"date-time":"2017-03-24T02:19:38Z","timestamp":1490321978000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7001406\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2014,11]]},"references-count":12,"URL":"https:\/\/doi.org\/10.1109\/iccad.2014.7001406","relation":{},"subject":[],"published":{"date-parts":[[2014,11]]}}}