{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,3]],"date-time":"2026-06-03T00:04:39Z","timestamp":1780445079725,"version":"3.54.1"},"reference-count":25,"publisher":"IEEE","license":[{"start":{"date-parts":[[2021,11,1]],"date-time":"2021-11-01T00:00:00Z","timestamp":1635724800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2021,11,1]],"date-time":"2021-11-01T00:00:00Z","timestamp":1635724800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2021,11,1]],"date-time":"2021-11-01T00:00:00Z","timestamp":1635724800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2021,11,1]]},"DOI":"10.1109\/iccad51958.2021.9643570","type":"proceedings-article","created":{"date-parts":[[2021,12,23]],"date-time":"2021-12-23T23:06:46Z","timestamp":1640300806000},"page":"1-8","source":"Crossref","is-referenced-by-count":22,"title":["Analytical Modeling of Transient Electromigration Stress based on Boundary Reflections"],"prefix":"10.1109","author":[{"given":"Mohammad Abdullah","family":"Al Shohel","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Vidya A.","family":"Chhabria","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Nestor","family":"Evmorfopoulos","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Sachin S.","family":"Sapatnekar","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1145\/2897937.2898070"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2018.2801221"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/DAC18074.2021.9586127"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2016.2523898"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TDMR.2017.2746660"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2017.2666723"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1016\/B978-0-12-812311-9.00006-2"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1063\/1.3527136"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM19573.2019.8993548"},{"key":"ref19","author":"chan","year":"2002","journal-title":"Integrated circuit design incorporating a power mesh"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1063\/1.336731"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1063\/1.1659998"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1063\/1.354073"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1063\/1.351204"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1145\/2463209.2488842"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1016\/j.mee.2013.08.013"},{"key":"ref2","doi-asserted-by":"crossref","first-page":"1587","DOI":"10.1109\/PROC.1969.7340","article-title":"electromigration failure modes in aluminum metallization for semiconductor devices","volume":"57","author":"black","year":"1969","journal-title":"Proceedings of the IEEE"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2005.855941"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1063\/1.322842"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2013.2264686"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TDMR.2005.853507"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/ASP-DAC47756.2020.9045303"},{"key":"ref24","year":"0","journal-title":"PDNSim"},{"key":"ref23","year":"0","journal-title":"The OpenROAD Project"},{"key":"ref25","author":"erdelyi","year":"1954","journal-title":"Tables of Integral Transforms"}],"event":{"name":"2021 IEEE\/ACM International Conference On Computer Aided Design (ICCAD)","location":"Munich, Germany","start":{"date-parts":[[2021,11,1]]},"end":{"date-parts":[[2021,11,4]]}},"container-title":["2021 IEEE\/ACM International Conference On Computer Aided Design (ICCAD)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/9643423\/9643432\/09643570.pdf?arnumber=9643570","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,5,10]],"date-time":"2022-05-10T16:55:13Z","timestamp":1652201713000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9643570\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021,11,1]]},"references-count":25,"URL":"https:\/\/doi.org\/10.1109\/iccad51958.2021.9643570","relation":{},"subject":[],"published":{"date-parts":[[2021,11,1]]}}}