{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,12,20]],"date-time":"2025-12-20T22:29:34Z","timestamp":1766269774442},"reference-count":28,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,10,28]],"date-time":"2023-10-28T00:00:00Z","timestamp":1698451200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,10,28]],"date-time":"2023-10-28T00:00:00Z","timestamp":1698451200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,10,28]]},"DOI":"10.1109\/iccad57390.2023.10323810","type":"proceedings-article","created":{"date-parts":[[2023,11,30]],"date-time":"2023-11-30T18:58:45Z","timestamp":1701370725000},"page":"1-8","source":"Crossref","is-referenced-by-count":7,"title":["Frequency-Domain Transient Electromigration Analysis Using Circuit Theory"],"prefix":"10.1109","author":[{"given":"Mohammad Abdullah","family":"Al Shohel","sequence":"first","affiliation":[{"name":"University of Minnesota,Minneapolis,MN,USA"}]},{"given":"Vidya A.","family":"Chhabria","sequence":"additional","affiliation":[{"name":"Arizona State University,Tempe,AZ,USA"}]},{"given":"Nestor","family":"Evmorfopoulos","sequence":"additional","affiliation":[{"name":"University of Thessaly,Volos,Greece"}]},{"given":"Sachin S.","family":"Sapatnekar","sequence":"additional","affiliation":[{"name":"University of Minnesota,Minneapolis,MN,USA"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TDMR.2005.853507"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/iedm.2017.8268472"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1063\/1.322842"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/PROC.1969.7340"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1063\/1.354073"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS.2014.6861154"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1116\/6.0000476"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/DAC18074.2021.9586127"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2016.2523898"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TDMR.2017.2746660"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1145\/2463209.2488842"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1145\/2897937.2898070"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TDMR.2010.2093526"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2017.2666723"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2018.2800707"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD51958.2021.9643570"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2021.114200"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1016\/B978-0-12-812311-9.00006-2"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1063\/1.3527136"},{"volume-title":"Heat Transfer: A Basic Approach","year":"1985","author":"Ozisik","key":"ref20"},{"volume-title":"IC Interconnect Analysis","year":"2002","author":"Celik","key":"ref21"},{"volume-title":"Timing","year":"2004","author":"Sapatnekar","key":"ref22"},{"volume-title":"Circuits, Interconnections and Packaging for VLSI","year":"1990","author":"Bakoglu","key":"ref23"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/43.712097"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/43.45867"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2020.3001264"},{"volume-title":"IBM power grid benchmarks.","year":"2023","key":"ref27"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/TDMR.2015.2508447"}],"event":{"name":"2023 IEEE\/ACM International Conference on Computer Aided Design (ICCAD)","start":{"date-parts":[[2023,10,28]]},"location":"San Francisco, CA, USA","end":{"date-parts":[[2023,11,2]]}},"container-title":["2023 IEEE\/ACM International Conference on Computer Aided Design (ICCAD)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10323590\/10323543\/10323810.pdf?arnumber=10323810","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,3,2]],"date-time":"2024-03-02T22:10:32Z","timestamp":1709417432000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10323810\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,10,28]]},"references-count":28,"URL":"https:\/\/doi.org\/10.1109\/iccad57390.2023.10323810","relation":{},"subject":[],"published":{"date-parts":[[2023,10,28]]}}}