{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,5]],"date-time":"2026-06-05T15:34:28Z","timestamp":1780673668305,"version":"3.54.1"},"reference-count":45,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,10,28]],"date-time":"2023-10-28T00:00:00Z","timestamp":1698451200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,10,28]],"date-time":"2023-10-28T00:00:00Z","timestamp":1698451200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/100000001","name":"NSF","doi-asserted-by":"publisher","award":["CCF-2007135,CCF-2113928"],"award-info":[{"award-number":["CCF-2007135,CCF-2113928"]}],"id":[{"id":"10.13039\/100000001","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,10,28]]},"DOI":"10.1109\/iccad57390.2023.10323817","type":"proceedings-article","created":{"date-parts":[[2023,11,30]],"date-time":"2023-11-30T18:58:45Z","timestamp":1701370725000},"page":"1-7","source":"Crossref","is-referenced-by-count":22,"title":["Real-time Thermal Map Estimation for AMD Multi-Core CPUs Using Transformer"],"prefix":"10.1109","author":[{"given":"Jincong","family":"Lu","sequence":"first","affiliation":[{"name":"University of California,Department of Electrical and Computer Engineering,Riverside,CA,USA,92521"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jinwei","family":"Zhang","sequence":"additional","affiliation":[{"name":"University of California,Department of Electrical and Computer Engineering,Riverside,CA,USA,92521"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Sheldon X.-D.","family":"Tan","sequence":"additional","affiliation":[{"name":"University of California,Department of Electrical and Computer Engineering,Riverside,CA,USA,92521"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","article-title":"Critical Reliability Challenges for The International Technology Roadmap for Semiconductors (ITRS)","year":"2003","journal-title":"2003, in International Sematech Technology Transfer Document 03024377A-TR"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/MM.2012.17"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/MM.2013.90"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ISCA.2003.1206984"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1145\/2187671.2187675"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2020.3007541"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ISLPED.2015.7273538"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2015.2474382"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2006.879797"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2006.876103"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2006.882589"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2011.6105408"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1145\/1255456.1255462"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/ISLPED.2013.6629264"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TPDS.2017.2732951"},{"key":"ref16","volume-title":"Intel Performance Counter Monitor (PCM)"},{"key":"ref17","volume-title":"AMD uProf software profiling tool"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/ASP-DAC47756.2020.9045204"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2021.3086112"},{"key":"ref20","first-page":"1","article-title":"Full-chip thermal map estimation for commercial multi-core cpus with generative adversarial learning","volume-title":"Proc. Int. Conf. on Computer Aided Design (ICCAD)","author":"Jin"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1115\/1.2957318"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1016\/S0026-2692(02)00055-1"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1145\/1698759.1698766"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2010.2098054"},{"issue":"1","key":"ref25","doi-asserted-by":"crossref","DOI":"10.1016\/j.vlsi.2013.07.003","article-title":"Compact thermal modeling for packaged microprocessor design with practical power maps","volume":"47","author":"Liu","year":"2014","journal-title":"Integration, the VLSI Journal"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1007\/b117332"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1145\/1629911.1630037"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1145\/1837274.1837291"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2011.45"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1145\/2228360.2228475"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2013.2244926"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1049\/iet-cds.2016.0201"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/ICCD.2008.4751897"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2013.2293422"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1038\/nature14539"},{"key":"ref36","volume-title":"Deep learning","author":"Goodfellow","year":"2016"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.48550\/ARXIV.1706.03762"},{"key":"ref38","volume-title":"Chatgpt from openai"},{"key":"ref39","article-title":"An image is worth 16\u00d716 words: Transformers for image recognition at scale","volume-title":"International Conference on Learning Representations","author":"Dosovitskiy"},{"key":"ref40","first-page":"690","article-title":"Thermal and ir drop analysis using convolutional encoder-decoder networks","volume-title":"Proc. Asia South Pacific Design Automation Conf. (ASPDAC)","author":"Chhabria"},{"key":"ref41","doi-asserted-by":"publisher","DOI":"10.1109\/ASP-DAC52403.2022.9712583"},{"key":"ref42","doi-asserted-by":"crossref","DOI":"10.1145\/1454115.1454128","article-title":"The PARSEC benchmark suite: Characterization and architectural implications","volume-title":"International Conference on Parallel Architectures and Compilation Techniques (PACT)","author":"Bienia"},{"key":"ref43","article-title":"Improving language understanding by generative pre-training","author":"Radford","year":"2018","journal-title":"arxiv"},{"key":"ref44","article-title":"Gaussian Error Linear Units (GELUs)","author":"Dan Hendrycks","year":"2016","journal-title":"arXiv e-prints"},{"key":"ref45","article-title":"TensorFlow: Large-scale machine learning on heterogeneous systems","author":"Abadi","year":"2015","journal-title":"software available from tensorflow.org"}],"event":{"name":"2023 IEEE\/ACM International Conference on Computer Aided Design (ICCAD)","location":"San Francisco, CA, USA","start":{"date-parts":[[2023,10,28]]},"end":{"date-parts":[[2023,11,2]]}},"container-title":["2023 IEEE\/ACM International Conference on Computer Aided Design (ICCAD)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10323590\/10323543\/10323817.pdf?arnumber=10323817","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,3,13]],"date-time":"2024-03-13T20:33:29Z","timestamp":1710362009000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10323817\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,10,28]]},"references-count":45,"URL":"https:\/\/doi.org\/10.1109\/iccad57390.2023.10323817","relation":{},"subject":[],"published":{"date-parts":[[2023,10,28]]}}}