{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,1]],"date-time":"2026-06-01T12:41:22Z","timestamp":1780317682354,"version":"3.54.1"},"reference-count":15,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,10,28]],"date-time":"2023-10-28T00:00:00Z","timestamp":1698451200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,10,28]],"date-time":"2023-10-28T00:00:00Z","timestamp":1698451200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100012166","name":"National Key R&D Program of China","doi-asserted-by":"publisher","award":["2021YFB3100903"],"award-info":[{"award-number":["2021YFB3100903"]}],"id":[{"id":"10.13039\/501100012166","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,10,28]]},"DOI":"10.1109\/iccad57390.2023.10323883","type":"proceedings-article","created":{"date-parts":[[2023,11,30]],"date-time":"2023-11-30T18:58:45Z","timestamp":1701370725000},"page":"1-8","source":"Crossref","is-referenced-by-count":3,"title":["EMSim+: Accelerating Electromagnetic Security Evaluation with Generative Adversarial Network"],"prefix":"10.1109","author":[{"given":"Ya","family":"Gao","sequence":"first","affiliation":[{"name":"School of Microelectronics, Tianjin University"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Haocheng","family":"Ma","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Tianjin University"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jindi","family":"Kong","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Tianjin University"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jiaji","family":"He","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Tianjin University"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yiqiang","family":"Zhao","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Tianjin University"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yier","family":"Jin","sequence":"additional","affiliation":[{"name":"University of Science and Technology of China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1007\/3-540-48405-1_25"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2023.3288600"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1145\/3568957"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TEMC.2008.2008907"},{"key":"ref5","first-page":"670","article-title":"EO-Shield: A multi-function protection scheme against side channel and focused ion beam attacks","volume-title":"Proceedings of the 28th Asia and South Pacific Design Automation Conference","author":"Gao"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/HLDVT.2005.1568839"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-642-17752-1_24"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2017.8203769"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TIFS.2023.3239184"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42614.2022.9731755"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/ASP-DAC47756.2020.9045178"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD45719.2019.8942063"},{"key":"ref13","first-page":"690","article-title":"Thermal and ir drop analysis using convolutional encoder-decoder networks","volume-title":"Proceedings of the 26th Asia and South Pacific Design Automation Conference","author":"Chhabria"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1145\/3422622"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1007\/11502760_28"}],"event":{"name":"2023 IEEE\/ACM International Conference on Computer Aided Design (ICCAD)","location":"San Francisco, CA, USA","start":{"date-parts":[[2023,10,28]]},"end":{"date-parts":[[2023,11,2]]}},"container-title":["2023 IEEE\/ACM International Conference on Computer Aided Design (ICCAD)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10323590\/10323543\/10323883.pdf?arnumber=10323883","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,3,2]],"date-time":"2024-03-02T22:14:21Z","timestamp":1709417661000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10323883\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,10,28]]},"references-count":15,"URL":"https:\/\/doi.org\/10.1109\/iccad57390.2023.10323883","relation":{},"subject":[],"published":{"date-parts":[[2023,10,28]]}}}