{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,7,9]],"date-time":"2026-07-09T15:20:16Z","timestamp":1783610416530,"version":"3.55.0"},"reference-count":27,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,10,28]],"date-time":"2023-10-28T00:00:00Z","timestamp":1698451200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,10,28]],"date-time":"2023-10-28T00:00:00Z","timestamp":1698451200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62174110,U21B2030,92264204"],"award-info":[{"award-number":["62174110,U21B2030,92264204"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100012166","name":"National Key R&D Program of China","doi-asserted-by":"publisher","award":["2021YFA0717400,2019YFA0706100"],"award-info":[{"award-number":["2021YFA0717400,2019YFA0706100"]}],"id":[{"id":"10.13039\/501100012166","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/100007219","name":"Natural Science Foundation of Shanghai","doi-asserted-by":"publisher","award":["23ZR1433200"],"award-info":[{"award-number":["23ZR1433200"]}],"id":[{"id":"10.13039\/100007219","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,10,28]]},"DOI":"10.1109\/iccad57390.2023.10323889","type":"proceedings-article","created":{"date-parts":[[2023,11,30]],"date-time":"2023-11-30T18:58:45Z","timestamp":1701370725000},"page":"1-9","source":"Crossref","is-referenced-by-count":7,"title":["TL-nvSRAM-CIM: Ultra-High-Density Three-Level ReRAM-Assisted Computing-in-nvSRAM with DC-Power Free Restore and Ternary MAC Operations"],"prefix":"10.1109","author":[{"given":"Dengfeng","family":"Wang","sequence":"first","affiliation":[{"name":"Shanghai Jiao Tong University,Department of Micro-Nano Electronics,Shanghai,China,200240"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Liukai","family":"Xu","sequence":"additional","affiliation":[{"name":"Shanghai Jiao Tong University,Department of Micro-Nano Electronics,Shanghai,China,200240"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Songyuan","family":"Liu","sequence":"additional","affiliation":[{"name":"Shanghai Jiao Tong University,Department of Micro-Nano Electronics,Shanghai,China,200240"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Zhi","family":"Li","sequence":"additional","affiliation":[{"name":"Shanghai Jiao Tong University,Department of Micro-Nano Electronics,Shanghai,China,200240"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yiming","family":"Chen","sequence":"additional","affiliation":[{"name":"Tsinghua University,Department of Electronic Engineering,Beijing,China,100084"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Weifeng","family":"He","sequence":"additional","affiliation":[{"name":"Shanghai Jiao Tong University,Department of Micro-Nano Electronics,Shanghai,China,200240"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Xueqing","family":"Li","sequence":"additional","affiliation":[{"name":"Tsinghua University,Department of Electronic Engineering,Beijing,China,100084"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yanan","family":"Sun","sequence":"additional","affiliation":[{"name":"Shanghai Jiao Tong University,Department of Micro-Nano Electronics,Shanghai,China,200240"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2021.3073254"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2022.3162602"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.2992886"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2951363"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42613.2021.9365769"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIT.2018.8510676"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2022.3141370"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1145\/3489517.3530558"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2021.3051856"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.23919\/DATE54114.2022.9774549"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2022.3199440"},{"key":"ref12","first-page":"115","article-title":"CREAM: computing in ReRAM-assisted energy and area-efficient SRAM for neural network acceleration","volume-title":"ACM\/IEEE Design Automation ConferenceCREAM: computing in ReRAM-assisted energy and area-efficient SRAM for neural network acceleration","author":"Liukai"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2017.8268325"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2019.2908243"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2015.2492421"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TMSCS.2016.2519022"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2022.3203146"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2018.8614664"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2022.3165352"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2018.8614593"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1145\/3037697.3037702"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2012.2185930"},{"key":"ref23","first-page":"770","article-title":"Deep residual learning for image recognition","volume-title":"Proceedings of the IEEE conference on computer vision and pattern recognition","author":"Kaiming"},{"key":"ref24","article-title":"Federated learning with matched averaging","volume-title":"International Conference on Learning Representations","author":"Wang"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/IMW51353.2021.9439607"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM19573.2019.8993484"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2021.3068470"}],"event":{"name":"2023 IEEE\/ACM International Conference on Computer Aided Design (ICCAD)","location":"San Francisco, CA, USA","start":{"date-parts":[[2023,10,28]]},"end":{"date-parts":[[2023,11,2]]}},"container-title":["2023 IEEE\/ACM International Conference on Computer Aided Design (ICCAD)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10323590\/10323543\/10323889.pdf?arnumber=10323889","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,3,2]],"date-time":"2024-03-02T22:14:33Z","timestamp":1709417673000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10323889\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,10,28]]},"references-count":27,"URL":"https:\/\/doi.org\/10.1109\/iccad57390.2023.10323889","relation":{},"subject":[],"published":{"date-parts":[[2023,10,28]]}}}