{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,11]],"date-time":"2026-03-11T17:11:10Z","timestamp":1773249070865,"version":"3.50.1"},"reference-count":24,"publisher":"IEEE","license":[{"start":{"date-parts":[[2023,10,28]],"date-time":"2023-10-28T00:00:00Z","timestamp":1698451200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,10,28]],"date-time":"2023-10-28T00:00:00Z","timestamp":1698451200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023,10,28]]},"DOI":"10.1109\/iccad57390.2023.10323995","type":"proceedings-article","created":{"date-parts":[[2023,11,30]],"date-time":"2023-11-30T18:58:45Z","timestamp":1701370725000},"page":"1-9","source":"Crossref","is-referenced-by-count":2,"title":["Multi-Product Optimization for 3D Heterogeneous Integration with D2W Bonding"],"prefix":"10.1109","author":[{"given":"Zhen","family":"Zhuang","sequence":"first","affiliation":[{"name":"The Chinese University of Hong Kong"}]},{"given":"Kai-Yuan","family":"Chao","sequence":"additional","affiliation":[{"name":"Huawei Technology Investment Co., Ltd.,Hong Kong Research Center"}]},{"given":"Bei","family":"Yu","sequence":"additional","affiliation":[{"name":"The Chinese University of Hong Kong"}]},{"given":"Tsung-Yi","family":"Ho","sequence":"additional","affiliation":[{"name":"The Chinese University of Hong Kong"}]},{"given":"Martin D.F.","family":"Wong","sequence":"additional","affiliation":[{"name":"The Chinese University of Hong Kong"}]}],"member":"263","reference":[{"key":"ref1","volume-title":"Heterogeneous Integration Roadmap (HIR) 2021 Edition, IEEE"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42614.2022.9731565"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42614.2022.9731678"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42614.2022.9731673"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC51906.2022.00037"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC51906.2022.00310"},{"key":"ref8","volume-title":"News"},{"key":"ref9","first-page":"604","article-title":"System-Level Process Variability Analysis and Mitigation for 3D MPSoCs","volume-title":"Proceedings of IEEE Design, Automation & Test in Europe Conference (DATE)","author":"Siddharth","year":"2009"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/iccad.2007.4397269"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2013.6571900"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC51906.2022.00031"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC51906.2022.00324"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2010.5419824"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/IISWC.2015.32"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/ISCA.2004.1310765"},{"key":"ref17","volume-title":"Gurobi Optimizer"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/101.17237"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2004.836656"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/ISLPED52811.2021.9502475"},{"key":"ref21","volume-title":"News"},{"key":"ref22","volume-title":"News"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/ICACCI.2018.8554639"},{"key":"ref24","volume-title":"News"},{"key":"ref25","volume-title":"News"}],"event":{"name":"2023 IEEE\/ACM International Conference on Computer Aided Design (ICCAD)","location":"San Francisco, CA, USA","start":{"date-parts":[[2023,10,28]]},"end":{"date-parts":[[2023,11,2]]}},"container-title":["2023 IEEE\/ACM International Conference on Computer Aided Design (ICCAD)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10323590\/10323543\/10323995.pdf?arnumber=10323995","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,3,14]],"date-time":"2024-03-14T04:56:01Z","timestamp":1710392161000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10323995\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,10,28]]},"references-count":24,"URL":"https:\/\/doi.org\/10.1109\/iccad57390.2023.10323995","relation":{},"subject":[],"published":{"date-parts":[[2023,10,28]]}}}