{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,11,21]],"date-time":"2025-11-21T05:51:12Z","timestamp":1763704272225,"version":"3.45.0"},"reference-count":29,"publisher":"IEEE","license":[{"start":{"date-parts":[[2025,10,26]],"date-time":"2025-10-26T00:00:00Z","timestamp":1761436800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,10,26]],"date-time":"2025-10-26T00:00:00Z","timestamp":1761436800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100003399","name":"Science and Technology Commission of Shanghai Municipality","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100003399","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2025,10,26]]},"DOI":"10.1109\/iccad66269.2025.11240671","type":"proceedings-article","created":{"date-parts":[[2025,11,20]],"date-time":"2025-11-20T18:39:34Z","timestamp":1763663974000},"page":"1-9","source":"Crossref","is-referenced-by-count":0,"title":["NSTherm: An Error-Bounded Network-Stochastic Fusion Thermal Simulator for Geometry-Adaptable Chiplets via Diffeomorphic Mapping and Neural-Guided Variance Reduction"],"prefix":"10.1109","author":[{"given":"Yuan","family":"Meng","sequence":"first","affiliation":[{"name":"Fudan University,State Key Laboratory of Integrated Chips and Systems, College of Integrated Circuits &#x0026; Micro-Nano Electronics,China"}]},{"given":"Yuyan","family":"Wang","sequence":"additional","affiliation":[{"name":"Fudan University,State Key Laboratory of Integrated Chips and Systems, College of Integrated Circuits &#x0026; Micro-Nano Electronics,China"}]},{"given":"Zhixuan","family":"Dong","sequence":"additional","affiliation":[{"name":"Fudan University,State Key Laboratory of Integrated Chips and Systems, College of Integrated Circuits &#x0026; Micro-Nano Electronics,China"}]},{"given":"Yonghan","family":"Luo","sequence":"additional","affiliation":[{"name":"Fudan University,State Key Laboratory of Integrated Chips and Systems, College of Integrated Circuits &#x0026; Micro-Nano Electronics,China"}]},{"given":"Changhao","family":"Yan","sequence":"additional","affiliation":[{"name":"Fudan University,State Key Laboratory of Integrated Chips and Systems, College of Integrated Circuits &#x0026; Micro-Nano Electronics,China"}]},{"given":"Keren","family":"Zhu","sequence":"additional","affiliation":[{"name":"Fudan University,State Key Laboratory of Integrated Chips and Systems, College of Integrated Circuits &#x0026; Micro-Nano Electronics,China"}]},{"given":"Zhaori","family":"Bi","sequence":"additional","affiliation":[{"name":"Fudan University,State Key Laboratory of Integrated Chips and Systems, College of Integrated Circuits &#x0026; Micro-Nano Electronics,China"}]},{"given":"Sheng-Guo","family":"Wang","sequence":"additional","affiliation":[{"name":"University of North Carolina at Charlotte,Department of Engineering Technology,USA"}]},{"given":"Dian","family":"Zhou","sequence":"additional","affiliation":[{"name":"Fudan University,State Key Laboratory of Integrated Chips and Systems, College of Integrated Circuits &#x0026; Micro-Nano Electronics,China"}]},{"given":"Xuan","family":"Zeng","sequence":"additional","affiliation":[{"name":"Fudan University,State Key Laboratory of Integrated Chips and Systems, College of Integrated Circuits &#x0026; Micro-Nano Electronics,China"}]}],"member":"263","reference":[{"doi-asserted-by":"publisher","key":"ref1","DOI":"10.23919\/DATE56975.2023.10137172"},{"volume-title":"Ansys","key":"ref2"},{"doi-asserted-by":"publisher","key":"ref4","DOI":"10.1109\/TVLSI.2006.876103"},{"doi-asserted-by":"publisher","key":"ref5","DOI":"10.1109\/TCAD.2021.3074613"},{"doi-asserted-by":"publisher","key":"ref6","DOI":"10.1109\/TVLSI.2020.3023464"},{"doi-asserted-by":"publisher","key":"ref7","DOI":"10.1109\/DAC18072.2020.9218754"},{"doi-asserted-by":"publisher","key":"ref8","DOI":"10.1109\/ICCAD57390.2023.10323696"},{"volume-title":"2020 IEEE\/ACM International Conference On Computer Aided Design (ICCAD)","author":"Jin","article-title":"Full-chip thermal map estimation for commercial multicore cpus with generative adversarial learning","key":"ref9"},{"doi-asserted-by":"publisher","key":"ref10","DOI":"10.1109\/ICCAD57390.2023.10323817"},{"doi-asserted-by":"publisher","key":"ref11","DOI":"10.1109\/DAC56929.2023.10247998"},{"doi-asserted-by":"publisher","key":"ref12","DOI":"10.1038\/s42256-021-00302-5"},{"doi-asserted-by":"publisher","key":"ref13","DOI":"10.1137\/22M1477751"},{"doi-asserted-by":"publisher","key":"ref14","DOI":"10.1145\/3676536.3676713"},{"volume-title":"International Conference on Learning Representations","author":"Li","article-title":"Fourier neural operator for parametric partial differential equations","key":"ref15"},{"doi-asserted-by":"publisher","key":"ref16","DOI":"10.1002\/(SICI)1097-0207(19970215)40:3<387::AID-NME69>3.0.CO;2-D"},{"doi-asserted-by":"publisher","key":"ref17","DOI":"10.1109\/TCAD.2012.2224346"},{"doi-asserted-by":"publisher","key":"ref19","DOI":"10.1109\/ASPDAC.2014.6742996"},{"key":"ref20","doi-asserted-by":"crossref","DOI":"10.1145\/3508352.3549457","article-title":"A high-precision stochastic solver for steady-state thermal analysis with fourier heat transfer robin boundary conditions","volume-title":"2022 IEEE\/ACM International Conference On Computer Aided Design (ICCAD)","author":"Yang"},{"doi-asserted-by":"publisher","key":"ref21","DOI":"10.1109\/TCAD.2024.3473829"},{"doi-asserted-by":"publisher","key":"ref22","DOI":"10.1109\/72.392253"},{"doi-asserted-by":"publisher","key":"ref23","DOI":"10.1007\/978-3-662-10063-9"},{"volume-title":"Reflecting Brownian motion, boundary local time and the Neumann problem","year":"1984","author":"Hsu","key":"ref24"},{"doi-asserted-by":"publisher","key":"ref25","DOI":"10.1038\/s43588-024-00732-2"},{"doi-asserted-by":"publisher","key":"ref26","DOI":"10.1023\/B:VISI.0000043755.93987.aa"},{"doi-asserted-by":"publisher","key":"ref27","DOI":"10.1109\/CVPR.2016.90"},{"doi-asserted-by":"publisher","key":"ref28","DOI":"10.1016\/j.neunet.2017.12.012"},{"doi-asserted-by":"publisher","key":"ref29","DOI":"10.48550\/ARXIV.1706.03762"},{"doi-asserted-by":"publisher","key":"ref30","DOI":"10.1137\/S0036139992236220"},{"volume-title":"Pardiso","key":"ref31"}],"event":{"name":"2025 IEEE\/ACM International Conference On Computer Aided Design (ICCAD)","start":{"date-parts":[[2025,10,26]]},"location":"Munich, Germany","end":{"date-parts":[[2025,10,30]]}},"container-title":["2025 IEEE\/ACM International Conference On Computer Aided Design (ICCAD)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/11240608\/11240621\/11240671.pdf?arnumber=11240671","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,11,21]],"date-time":"2025-11-21T05:42:45Z","timestamp":1763703765000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11240671\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,10,26]]},"references-count":29,"URL":"https:\/\/doi.org\/10.1109\/iccad66269.2025.11240671","relation":{},"subject":[],"published":{"date-parts":[[2025,10,26]]}}}