{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,8,26]],"date-time":"2026-08-26T16:09:29Z","timestamp":1787760569931,"version":"build-2784847793"},"reference-count":31,"publisher":"IEEE","license":[{"start":{"date-parts":[[2025,10,26]],"date-time":"2025-10-26T00:00:00Z","timestamp":1761436800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,10,26]],"date-time":"2025-10-26T00:00:00Z","timestamp":1761436800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2025,10,26]]},"DOI":"10.1109\/iccad66269.2025.11240761","type":"proceedings-article","created":{"date-parts":[[2025,11,20]],"date-time":"2025-11-20T18:39:34Z","timestamp":1763663974000},"page":"1-9","source":"Crossref","is-referenced-by-count":1,"title":["Waferscale Silicon Photonics Systems: A Cost-Benefit Analysis and Optimization"],"prefix":"10.1109","author":[{"given":"Robert","family":"Bao","sequence":"first","affiliation":[{"name":"UIUC"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Zongrui","family":"Cai","sequence":"additional","affiliation":[{"name":"UIUC"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Shuangliang","family":"Chen","sequence":"additional","affiliation":[{"name":"UIUC"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Ajay","family":"Joshi","sequence":"additional","affiliation":[{"name":"Lightmatter"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Darius","family":"Bunandar","sequence":"additional","affiliation":[{"name":"Lightmatter"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Rakesh","family":"Kumar","sequence":"additional","affiliation":[{"name":"UIUC"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1145\/1555754.1555808"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1145\/1815961.1815977"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1147\/JRD.2019.2940427"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC32862.2020.00013"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/MM.2021.3112025"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/HCS55958.2022.9895534"},{"key":"ref7","first-page":"215","article-title":"Waferscale network switches","volume-title":"2024 ACM\/IEEE 51st Annual International Symposium on Computer Architecture (ISCA)","author":"Chen"},{"issue":"9","key":"ref8","first-page":"1423","article-title":"Universal chiplet interconnect express (ucie): An open industry standard for innovations with chiplets at package level","volume-title":"IEEE Transactions on Components, Packaging and Manufacturing Technology","volume":"12","author":"Das Sharma","year":"2022"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/HCS55958.2022.9895610"},{"key":"ref10","first-page":"2229","article-title":"Hybrid interconnect infrastructure for inter-chiplet communication in wafer-scale systems","volume-title":"2024 IEEE 74th Electronic Components and Technology Conference (ECTC)","author":"Safari"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/MM.2023.3237927"},{"issue":"6","key":"ref12","first-page":"95","article-title":"Ring resonator modulators in silicon for interchip photonic links","volume-title":"IEEE Journal of Selected Topics in Quantum Electronics","volume":"19","author":"Li","year":"2013"},{"issue":"6","key":"ref13","first-page":"A82","article-title":"Silicon nitride passive and active photonic integrated circuits: trends and prospects","volume-title":"Photonics Research","volume":"10","author":"Xiang","year":"2022"},{"issue":"17","key":"ref14","first-page":"24274","article-title":"Power handling of silicon microring modulators","volume-title":"Optics Express","volume":"27","author":"De Cea","year":"2019"},{"key":"ref15","doi-asserted-by":"crossref","first-page":"1","DOI":"10.1364\/CLEO_SI.2011.CThP4","article-title":"Performance guidelines for wdm interconnects based on silicon microring resonators","volume-title":"CLEO: 2011 - Laser Science to Photonic Applications","author":"Preston","year":"2011"},{"issue":"9","key":"ref16","first-page":"14341","article-title":"Study of nonlinear effects and self-heating in a silicon microring resonator including a shockley-read-hall model for carrier recombination","volume-title":"Optics Express","volume":"30","author":"Novarese","year":"2022"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1145\/1394608.1382135"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1145\/2597652.2597664"},{"issue":"4","key":"ref19","first-page":"901","article-title":"Multilayer Silicon Nitride-on-Silicon Integrated Photonic Platforms and Devices","volume-title":"Journal of Lightwave Technology","volume":"33","author":"Sacher","year":"2015"},{"key":"ref20","first-page":"1017","article-title":"Characterization of the communication patterns of scientific applications on blue gene\/p","volume-title":"2011 IEEE International Symposium on Parallel and Distributed Processing Workshops and Phd Forum","author":"Raponi"},{"key":"ref21","article-title":"Llm-analysis: Latency and memory analysis of transformer models for training and inference","author":"Li","year":"2023"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1145\/1964218.1964225"},{"key":"ref23","first-page":"101","article-title":"Splash-3: A properly synchronized benchmark suite for contemporary research","volume-title":"2016 IEEE International Symposium on Performance Analysis of Systems and Software (ISPASS)","author":"Sakalis"},{"key":"ref24","first-page":"649","article-title":"Crossing-aware channel routing for photonic waveguides","volume-title":"2013 IEEE 56th International Midwest Symposium on Circuits and Systems (MWSCAS)","author":"Condrat"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1145\/3635031"},{"issue":"12","key":"ref26","first-page":"2209","article-title":"Silicon nitride in silicon photonics","volume-title":"Proceedings of the IEEE","volume":"106","author":"Blumenthal"},{"issue":"12","key":"ref27","first-page":"2232","article-title":"Monolithically integrated multilayer silicon nitride-on-silicon waveguide platforms for 3-d photonic circuits and devices","volume-title":"Proceedings of the IEEE","volume":"106","author":"Sacher"},{"key":"ref28","first-page":"1","article-title":"Accelerating Cache Coherence in Manycore Processor through Silicon Photonic Chiplet","volume-title":"2022 IEEE\/ACM International Conference On Computer Aided Design (ICCAD)","author":"Li"},{"issue":"7","key":"ref29","first-page":"762","article-title":"High-speed waveguide Ge\/Si avalanche photodiode with a gain-bandwidth product of 615 GHz","volume-title":"Optica","volume":"9","author":"Xiang","year":"2022"},{"key":"ref30","article-title":"Mics lab \u2014 3d-integrated high-sensitivity optical receiver"},{"key":"ref31","doi-asserted-by":"crossref","DOI":"10.1145\/3579371.3589350","article-title":"Tpu v4: An optically reconfigurable supercomputer for machine learning with hardware support for embeddings","author":"Jouppi","year":"2023"}],"event":{"name":"2025 IEEE\/ACM International Conference On Computer Aided Design (ICCAD)","location":"Munich, Germany","start":{"date-parts":[[2025,10,26]]},"end":{"date-parts":[[2025,10,30]]}},"container-title":["2025 IEEE\/ACM International Conference On Computer Aided Design (ICCAD)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/11240608\/11240621\/11240761.pdf?arnumber=11240761","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,11,21]],"date-time":"2025-11-21T05:44:04Z","timestamp":1763703844000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11240761\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,10,26]]},"references-count":31,"URL":"https:\/\/doi.org\/10.1109\/iccad66269.2025.11240761","relation":{},"subject":[],"published":{"date-parts":[[2025,10,26]]}}}