{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,4]],"date-time":"2024-09-04T17:17:30Z","timestamp":1725470250350},"reference-count":10,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2007,10]]},"DOI":"10.1109\/iccd.2007.4601951","type":"proceedings-article","created":{"date-parts":[[2008,8,21]],"date-time":"2008-08-21T15:14:39Z","timestamp":1219331679000},"page":"547-552","source":"Crossref","is-referenced-by-count":0,"title":["Passive compensation for high performance inter-chip communication"],"prefix":"10.1109","author":[{"family":"Chun-Chen Liu","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"family":"Haikun Zhu","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Chung-Kuan","family":"Cheng","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","doi-asserted-by":"crossref","first-page":"230","DOI":"10.1145\/369691.369779","article-title":"Analysis and optimization of thermal issues in highperformance vlsi","author":"banergee","year":"2001","journal-title":"ISPD"},{"journal-title":"High-performance low-power vlsi design","year":"2007","author":"zhu","key":"ref3"},{"journal-title":"High Speed Signal Propagation Advanced Black Magic","year":"2003","author":"johnson","key":"ref10"},{"key":"ref6","first-page":"2131","article-title":"Electromagetic induction and its propagation","author":"wu","year":"2003","journal-title":"IEEE Journal of Solid-State Circuits"},{"key":"ref5","first-page":"79","article-title":"Integrated transversal equalizers in high-speed fiber-optics systems","author":"heaviside","year":"1887","journal-title":"XL The Electrician XIX"},{"key":"ref8","article-title":"High-performance electrical signaling","author":"dally","year":"1998","journal-title":"Intl Conf Massively Parallel Processing Using Optical Interconnections"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2003.1249366"},{"key":"ref2","article-title":"Surfliner: A distortionless electrical signaling scheme for speed of light on-chip communications","author":"chen","year":"2006","journal-title":"Proc Asia South Pacific Design Automation Conf"},{"key":"ref9","article-title":"Design guideline for resistive termination of on-chip high speed interconnects","author":"hashmoto","year":"2005","journal-title":"Proc IEEE Custom Integrated Circuits Conf"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1147\/rd.425.0597"}],"event":{"name":"2007 25th International Conference on Computer Design ICCD 2007","start":{"date-parts":[[2007,10,7]]},"location":"Lake Tahoe, CA, USA","end":{"date-parts":[[2007,10,10]]}},"container-title":["2007 25th International Conference on Computer Design"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/4591423\/4601871\/04601951.pdf?arnumber=4601951","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2019,5,13]],"date-time":"2019-05-13T14:16:21Z","timestamp":1557756981000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/4601951\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2007,10]]},"references-count":10,"URL":"https:\/\/doi.org\/10.1109\/iccd.2007.4601951","relation":{},"subject":[],"published":{"date-parts":[[2007,10]]}}}