{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,22]],"date-time":"2026-04-22T19:27:14Z","timestamp":1776886034467,"version":"3.51.2"},"reference-count":14,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2010,10]]},"DOI":"10.1109\/iccd.2010.5647690","type":"proceedings-article","created":{"date-parts":[[2010,12,9]],"date-time":"2010-12-09T15:42:09Z","timestamp":1291909329000},"page":"384-389","source":"Crossref","is-referenced-by-count":18,"title":["Temperature-to-power mapping"],"prefix":"10.1109","author":[{"given":"Zhenyu","family":"Qi","sequence":"first","affiliation":[]},{"given":"Brett H.","family":"Meyer","sequence":"additional","affiliation":[]},{"given":"Wei","family":"Huang","sequence":"additional","affiliation":[]},{"given":"Robert J.","family":"Ribando","sequence":"additional","affiliation":[]},{"given":"Kevin","family":"Skadron","sequence":"additional","affiliation":[]},{"given":"Mircea R.","family":"Stan","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"13","author":"shapiro","year":"2001","journal-title":"Computer Vision"},{"key":"14","doi-asserted-by":"publisher","DOI":"10.1109\/STHERM.2006.1625229"},{"key":"11","first-page":"9","article-title":"A 1.1V 35?m \ufffd 35?m thermal sensor with supply voltage sensitivity of 2?C\/10%- supply for thermal management on the SX-9 supercomputer","author":"saneyoshi","year":"2006","journal-title":"Symposium on VLSI Circuits"},{"key":"12","doi-asserted-by":"publisher","DOI":"10.1109\/STHERM.2010.5444292"},{"key":"3","doi-asserted-by":"crossref","first-page":"2","DOI":"10.1145\/871656.859620","article-title":"Temperature-aware microarchitecture","author":"skadron","year":"2003","journal-title":"International Symposium on Computer Architecture"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1109\/HPCA.2010.5416627"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1109\/MDT.2002.1033790"},{"key":"10","doi-asserted-by":"publisher","DOI":"10.1109\/ITHERM.2006.1645409"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.1109\/STHERM.2007.352405"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1145\/1273440.1250700"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2006.885064"},{"key":"4","first-page":"319","article-title":"Efficient full-chip thermal modeling and analysis","author":"li","year":"2004","journal-title":"Proc Int Conf on Computer Aided Design (ICCAD)"},{"key":"9","author":"beck","year":"1985","journal-title":"Inverse Heat Conduction Ill-Posed Problems"},{"key":"8","doi-asserted-by":"publisher","DOI":"10.1145\/1840845.1840914"}],"event":{"name":"2010 IEEE International Conference on Computer Design (ICCD 2010)","location":"Amsterdam, Netherlands","start":{"date-parts":[[2010,10,3]]},"end":{"date-parts":[[2010,10,6]]}},"container-title":["2010 IEEE International Conference on Computer Design"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/5640356\/5647518\/05647690.pdf?arnumber=5647690","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,19]],"date-time":"2017-06-19T17:03:08Z","timestamp":1497891788000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/5647690\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2010,10]]},"references-count":14,"URL":"https:\/\/doi.org\/10.1109\/iccd.2010.5647690","relation":{},"subject":[],"published":{"date-parts":[[2010,10]]}}}