{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,16]],"date-time":"2026-04-16T18:55:05Z","timestamp":1776365705587,"version":"3.51.2"},"reference-count":25,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2014,10]]},"DOI":"10.1109\/iccd.2014.6974690","type":"proceedings-article","created":{"date-parts":[[2014,12,8]],"date-time":"2014-12-08T17:29:51Z","timestamp":1418059791000},"page":"256-263","source":"Crossref","is-referenced-by-count":22,"title":["Modeling and analysis of Phase Change Materials for efficient thermal management"],"prefix":"10.1109","author":[{"given":"Fulya","family":"Kaplan","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Charlie","family":"De Vivero","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Samuel","family":"Howes","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Manish","family":"Arora","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Houman","family":"Homayoun","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Wayne","family":"Burleson","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Dean","family":"Tullsen","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ayse K.","family":"Coskun","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"19","doi-asserted-by":"publisher","DOI":"10.1145\/1669112.1669172"},{"key":"17","doi-asserted-by":"publisher","DOI":"10.1007\/s00231-011-0888-3"},{"key":"18","first-page":"1","article-title":"Analysis and topology optimization of heat sinks with a phase-change material on comsol multiphysics platform","author":"srinivas","year":"2006","journal-title":"COMSOL Users Conference"},{"key":"15","first-page":"1","article-title":"Application of phase change materials for low duty cycle high peak load power supplies","author":"stupar","year":"2010","journal-title":"International Conference on Integrated Power Electronics Systems (CIPS)"},{"key":"16","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2013.6691127"},{"key":"13","doi-asserted-by":"publisher","DOI":"10.1109\/EPTC.2007.4469773"},{"key":"14","doi-asserted-by":"publisher","DOI":"10.1109\/TDMR.2004.840854"},{"key":"11","doi-asserted-by":"publisher","DOI":"10.1145\/1555349.1555369"},{"key":"12","doi-asserted-by":"publisher","DOI":"10.1109\/TCAPT.2003.811480"},{"key":"21","doi-asserted-by":"publisher","DOI":"10.1109\/MM.2006.82"},{"key":"20","author":"conway","year":"2009","journal-title":"Blade Computing with the AMD Opteron Processor (Magny-cours)"},{"key":"22","author":"thoziyoor","year":"2008","journal-title":"Cacti 5 1 Tech Rep"},{"key":"23","author":"hale","year":"1971","journal-title":"Phase Change Materials Handbook"},{"key":"24","doi-asserted-by":"publisher","DOI":"10.1016\/j.applthermaleng.2005.11.022"},{"key":"25","doi-asserted-by":"publisher","DOI":"10.1109\/ITHERM.2014.6892372"},{"key":"3","doi-asserted-by":"publisher","DOI":"10.1145\/2000064.2000104"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1109\/ITHERM.1998.689600"},{"key":"10","doi-asserted-by":"publisher","DOI":"10.1109\/TPDS.2012.117"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1109\/DATE.2010.5457228"},{"key":"7","doi-asserted-by":"crossref","first-page":"2","DOI":"10.1145\/871656.859620","article-title":"Temperature-Aware microarchitecture","author":"skadron","year":"2003","journal-title":"International Symposium on Computer Architecture ISCA"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1145\/2380445.2380504"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1145\/2451116.2451135"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1109\/HPCA.2012.6169031"},{"key":"9","doi-asserted-by":"publisher","DOI":"10.1145\/1629911.1630039"},{"key":"8","year":"0","journal-title":"Comsol Multiphysics"}],"event":{"name":"2014 32nd IEEE International Conference on Computer Design (ICCD)","location":"Seoul, South Korea","start":{"date-parts":[[2014,10,19]]},"end":{"date-parts":[[2014,10,22]]}},"container-title":["2014 IEEE 32nd International Conference on Computer Design (ICCD)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6964907\/6974646\/06974690.pdf?arnumber=6974690","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2020,10,14]],"date-time":"2020-10-14T11:12:42Z","timestamp":1602673962000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/6974690"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2014,10]]},"references-count":25,"URL":"https:\/\/doi.org\/10.1109\/iccd.2014.6974690","relation":{},"subject":[],"published":{"date-parts":[[2014,10]]}}}