{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,10,27]],"date-time":"2025-10-27T16:07:39Z","timestamp":1761581259844,"version":"3.28.0"},"reference-count":20,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2014,10]]},"DOI":"10.1109\/iccd.2014.6974697","type":"proceedings-article","created":{"date-parts":[[2014,12,8]],"date-time":"2014-12-08T17:29:51Z","timestamp":1418059791000},"page":"300-307","source":"Crossref","is-referenced-by-count":6,"title":["DFM is dead - Long live DFM"],"prefix":"10.1109","author":[{"given":"Robert","family":"Aitken","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"David","family":"Pietromonaco","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Brian","family":"Cline","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"19","doi-asserted-by":"crossref","DOI":"10.1117\/12.879643","article-title":"Decomposition-Aware standard cell design flows to enable double-patterning technology","author":"liebmann","year":"2011","journal-title":"Proc SPIE Adv Lithography"},{"key":"17","doi-asserted-by":"publisher","DOI":"10.1109\/ISQED.2013.6523642"},{"key":"18","doi-asserted-by":"publisher","DOI":"10.1109\/DAC.2005.193833"},{"journal-title":"PrimeTime Advanced OCV Technology","year":"2009","author":"walia","key":"15"},{"key":"16","doi-asserted-by":"publisher","DOI":"10.1145\/1629911.1629949"},{"key":"13","doi-asserted-by":"publisher","DOI":"10.1109\/VLSI.Design.2010.23"},{"key":"14","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIT.2007.4339738"},{"key":"11","doi-asserted-by":"publisher","DOI":"10.1109\/ASIC.2002.1158094"},{"key":"12","doi-asserted-by":"crossref","DOI":"10.1117\/12.772889","article-title":"Shaping gate channels for improved devices","volume":"6925","author":"gupta","year":"2008","journal-title":"Proc SPIE Adv Lithography"},{"journal-title":"TSMC Reference Flow v6 0 As Quoted by Cadence Design Systems in Df","year":"0","key":"3"},{"key":"20","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2007.907061"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1109\/MDT.2011.12"},{"key":"1","first-page":"144","volume":"21","year":"2003","journal-title":"IEEE Design and Test of Computers"},{"key":"10","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-540-30205-6_15"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2013.6724597"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2013.6724591"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1109\/TSM.2004.835727"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1109\/ISQED.2006.50"},{"key":"9","doi-asserted-by":"publisher","DOI":"10.1109\/MDT.2004.15"},{"key":"8","doi-asserted-by":"publisher","DOI":"10.1145\/776028.776031"}],"event":{"name":"2014 32nd IEEE International Conference on Computer Design (ICCD)","start":{"date-parts":[[2014,10,19]]},"location":"Seoul, South Korea","end":{"date-parts":[[2014,10,22]]}},"container-title":["2014 IEEE 32nd International Conference on Computer Design (ICCD)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6964907\/6974646\/06974697.pdf?arnumber=6974697","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2020,10,14]],"date-time":"2020-10-14T11:19:12Z","timestamp":1602674352000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/6974697"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2014,10]]},"references-count":20,"URL":"https:\/\/doi.org\/10.1109\/iccd.2014.6974697","relation":{},"subject":[],"published":{"date-parts":[[2014,10]]}}}