{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,10,31]],"date-time":"2025-10-31T07:40:24Z","timestamp":1761896424479},"reference-count":9,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2016,10]]},"DOI":"10.1109\/iccd.2016.7753318","type":"proceedings-article","created":{"date-parts":[[2016,11,24]],"date-time":"2016-11-24T16:40:00Z","timestamp":1480005600000},"page":"420-423","source":"Crossref","is-referenced-by-count":13,"title":["Concurrent Migration of Multiple Pages in software-managed hybrid main memory"],"prefix":"10.1109","author":[{"given":"Santiago","family":"Bock","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Bruce R.","family":"Childers","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Rami","family":"Melhem","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Daniel","family":"Mosse","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref4","article-title":"Operating system support for NVM+DRAM hybrid main memory","author":"mogul","year":"2009","journal-title":"Workshop on Hot Topics in Operating Systems"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/HPCA.2015.7056027"},{"key":"ref6","article-title":"Characterizing the overhead of software-managed hybrid main memory","author":"bock","year":"2015","journal-title":"Proc Int Symp Modeling Analysis and Simulation of Computer and Telecommunication Systems"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1145\/1995896.1995911"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/NVMSA.2015.7304374"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1145\/2597917.2597924"},{"key":"ref2","first-page":"101","article-title":"Exploring phase change memory and 3D die-stacking for power\/thermal friendly, fast and durable memory archi-tectures","author":"zhang","year":"2009","journal-title":"Proc Int l Conf Parallel Architectures and Compilation Techniques"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1145\/1555754.1555758"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1145\/1629911.1630086"}],"event":{"name":"2016 IEEE 34th International Conference on Computer Design (ICCD)","start":{"date-parts":[[2016,10,2]]},"location":"Scottsdale, AZ, USA","end":{"date-parts":[[2016,10,5]]}},"container-title":["2016 IEEE 34th International Conference on Computer Design (ICCD)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/7742853\/7753252\/07753318.pdf?arnumber=7753318","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2016,12,20]],"date-time":"2016-12-20T19:25:40Z","timestamp":1482261940000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7753318\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2016,10]]},"references-count":9,"URL":"https:\/\/doi.org\/10.1109\/iccd.2016.7753318","relation":{},"subject":[],"published":{"date-parts":[[2016,10]]}}}