{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,21]],"date-time":"2024-09-21T04:20:24Z","timestamp":1726892424819},"reference-count":5,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,7,9]],"date-time":"2024-07-09T00:00:00Z","timestamp":1720483200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,7,9]],"date-time":"2024-07-09T00:00:00Z","timestamp":1720483200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,7,9]]},"DOI":"10.1109\/icce-taiwan62264.2024.10674516","type":"proceedings-article","created":{"date-parts":[[2024,9,18]],"date-time":"2024-09-18T17:51:53Z","timestamp":1726681913000},"page":"485-486","source":"Crossref","is-referenced-by-count":0,"title":["3D-PECUT: 3D Point cloud hiErarchical fusion-based ConvolUtional Transformers for Wire Bonding Inspection"],"prefix":"10.1109","author":[{"given":"Shang Li","family":"Yuen","sequence":"first","affiliation":[{"name":"MIMOS Berhad,Advanced Intelligence Lab,Kuala Lumpur,Malaysia"}]},{"given":"Phooi Yee","family":"Lau","sequence":"additional","affiliation":[{"name":"MIMOS Berhad,Advanced Intelligence Lab,Kuala Lumpur,Malaysia"}]},{"given":"Chin Wee","family":"Wong","sequence":"additional","affiliation":[{"name":"MIMOS Berhad,Advanced Intelligence Lab,Kuala Lumpur,Malaysia"}]},{"given":"Muhammad Hafiz","family":"Samsuri","sequence":"additional","affiliation":[{"name":"MIMOS Berhad,Advanced Intelligence Lab,Kuala Lumpur,Malaysia"}]},{"given":"Nur Afiqah","family":"Kamarudin","sequence":"additional","affiliation":[{"name":"MIMOS Berhad,Advanced Intelligence Lab,Kuala Lumpur,Malaysia"}]},{"given":"Muhammad Syukri Mohd","family":"Talib","sequence":"additional","affiliation":[{"name":"MIMOS Berhad,Advanced Intelligence Lab,Kuala Lumpur,Malaysia"}]},{"given":"Hock Woon","family":"Hon","sequence":"additional","affiliation":[{"name":"MIMOS Berhad,Advanced Intelligence Lab,Kuala Lumpur,Malaysia"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/cvpr.2015.7298801"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/cvpr.2017.16"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.48550\/ARXIV.1706.03762"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/CVPR.2016.90"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/APSIPAASC58517.2023.10317272"}],"event":{"name":"2024 International Conference on Consumer Electronics - Taiwan (ICCE-Taiwan)","start":{"date-parts":[[2024,7,9]]},"location":"Taichung, Taiwan","end":{"date-parts":[[2024,7,11]]}},"container-title":["2024 International Conference on Consumer Electronics - Taiwan (ICCE-Taiwan)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10673884\/10673887\/10674516.pdf?arnumber=10674516","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,9,20]],"date-time":"2024-09-20T06:30:42Z","timestamp":1726813842000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10674516\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,7,9]]},"references-count":5,"URL":"https:\/\/doi.org\/10.1109\/icce-taiwan62264.2024.10674516","relation":{},"subject":[],"published":{"date-parts":[[2024,7,9]]}}}