{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,10,29]],"date-time":"2024-10-29T20:52:05Z","timestamp":1730235125770,"version":"3.28.0"},"reference-count":15,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2017,11]]},"DOI":"10.1109\/iccis.2017.8274874","type":"proceedings-article","created":{"date-parts":[[2018,2,1]],"date-time":"2018-02-01T21:48:43Z","timestamp":1517521723000},"page":"758-762","source":"Crossref","is-referenced-by-count":1,"title":["The signal integrity design and simulation of triple modular redundant (TMR) computer"],"prefix":"10.1109","author":[{"given":"Pan","family":"Zheng","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Qi","family":"Zheng","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Zhankui","family":"Zeng","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Liman","family":"Yang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref10","first-page":"625","article-title":"3D Mobile CPU system assembly by z-axis stack connector solutions [C]","volume":"20","author":"omer","year":"0","journal-title":"Proc IEEE 60th Electron Compon Techn Conf"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TADVP.2004.831897"},{"key":"ref12","article-title":"Method of the Suppression of Simultaneous Switching Noise with Multi-stage Capacitors in High-Speed PCB","volume":"42","author":"yong-zhe","year":"2013","journal-title":"Journal of University of Electronic Science and Technology of China Mar"},{"key":"ref13","article-title":"Improvement of linear equivalent circuit model to identify simultaneous switching noise current in cryptographic integrated circuits","author":"kengo[1]","year":"2013","journal-title":"IEEE Int Symp On Electromagnetic Compatibility (EMC)"},{"key":"ref14","first-page":"235","author":"li","year":"2007","journal-title":"Jitter noise and signal integrity at high-speed[M]"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2008.2010086"},{"key":"ref4","first-page":"1","article-title":"Stop-band analysis of multi-via EBG structure[C]","author":"yan","year":"2012","journal-title":"International conference on Microwave and Millimeter Wave Technology"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/LMWC.2002.807713"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2005.854248"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/LMWC.2005.852779"},{"key":"ref8","article-title":"Power bus noise resuction using power island in printed circuit board designs [C]","author":"hubing","year":"1999","journal-title":"Electromagnetic Compatibility 1999 International Symposium on"},{"key":"ref7","first-page":"314","article-title":"Study of the incremental crosstalk stimulation testing model of high-speed interconnects[J]","volume":"36","author":"yu-ling","year":"2009","journal-title":"Journal of Xidian University"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/22.798001"},{"key":"ref1","article-title":"Analysis of the Electromagnetic Band-gap Structure for Simultaneous Switching NoiseSuppression and Transmission Characteristic in High-speed Printed Circuit Board","volume":"35","author":"dong-chu","year":"2013","journal-title":"J Journal of Electronics Information Technology"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TMAG.2010.2089433"}],"event":{"name":"2017 IEEE International Conference on Cybernetics and Intelligent Systems (CIS) and IEEE Conference on Robotics, Automation and Mechatronics (RAM)","start":{"date-parts":[[2017,11,19]]},"location":"Ningbo","end":{"date-parts":[[2017,11,21]]}},"container-title":["2017 IEEE International Conference on Cybernetics and Intelligent Systems (CIS) and IEEE Conference on Robotics, Automation and Mechatronics (RAM)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8265082\/8274737\/08274874.pdf?arnumber=8274874","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2018,3,12]],"date-time":"2018-03-12T21:57:17Z","timestamp":1520891837000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/8274874\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2017,11]]},"references-count":15,"URL":"https:\/\/doi.org\/10.1109\/iccis.2017.8274874","relation":{},"subject":[],"published":{"date-parts":[[2017,11]]}}}