{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,24]],"date-time":"2026-02-24T08:39:16Z","timestamp":1771922356725,"version":"3.50.1"},"reference-count":29,"publisher":"IEEE","license":[{"start":{"date-parts":[[2025,10,19]],"date-time":"2025-10-19T00:00:00Z","timestamp":1760832000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,10,19]],"date-time":"2025-10-19T00:00:00Z","timestamp":1760832000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2025,10,19]]},"DOI":"10.1109\/iccvw69036.2025.00145","type":"proceedings-article","created":{"date-parts":[[2026,2,23]],"date-time":"2026-02-23T20:44:02Z","timestamp":1771879442000},"page":"1362-1368","source":"Crossref","is-referenced-by-count":0,"title":["PCB-SAID: A Low-Cost Camera-Based Dataset for Few-Shot SMD Assembly Inspection"],"prefix":"10.1109","author":[{"given":"Raffaele","family":"Mineo","sequence":"first","affiliation":[{"name":"Deepsensing SRL,Catania,Italy"}]},{"given":"Amelia","family":"Sorrenti","sequence":"additional","affiliation":[{"name":"Deepsensing SRL,Catania,Italy"}]},{"given":"Robin","family":"Faro","sequence":"additional","affiliation":[{"name":"Deepsensing SRL,Catania,Italy"}]},{"given":"Gabriele","family":"Mineo","sequence":"additional","affiliation":[{"name":"Deepsensing SRL,Catania,Italy"}]},{"given":"Francesco","family":"Cancelliere","sequence":"additional","affiliation":[{"name":"Deepsensing SRL,Catania,Italy"}]},{"given":"Alberto","family":"Faro","sequence":"additional","affiliation":[{"name":"Deepsensing SRL,Catania,Italy"}]}],"member":"263","reference":[{"key":"ref1","article-title":"Vision datasets: A benchmark for vision-based industrial inspection","author":"Bai","year":"2023","journal-title":"arXiv preprint"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/CVPR.2019.00982"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1201\/9781003478713-7"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-030-58452-8_13"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.3390\/app11167657"},{"key":"ref6","first-page":"1126","article-title":"Model-agnostic meta-learning for fast adaptation of deep networks","volume-title":"International conference on machine learning","author":"Finn","year":"2017"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.18535\/ijsrm\/v12i10.ec06"},{"key":"ref8","article-title":"Ross Girshick. Fast r-cnn","volume-title":"International Conference on Computer Vision (ICCV)","year":"2015"},{"key":"ref9","article-title":"Deep residual learning for image recognition. 10.48550","author":"He","year":"2015","journal-title":"arXiv preprint"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ICCV.2017.322"},{"key":"ref11","article-title":"Chino Hills. Ipc-a-610; acceptability of electronic assemblies","volume-title":"IPC Standards","year":"2017"},{"key":"ref12","article-title":"A pcb dataset for defects detection and classification","author":"Huang","year":"2019","journal-title":"arXiv preprint"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1145\/3588032"},{"key":"ref14","article-title":"Yolov11: An overview of the key architectural enhancements","volume-title":"arXiv preprint","author":"Khanam","year":"2024"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/ICCV51070.2023.00371"},{"key":"ref16","author":"Li","year":"2022","journal-title":"Pcb-aoi"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2023.3245093"},{"key":"ref18","article-title":"Fics-pcb: A multimodal image dataset for automated printed circuit board visual inspection","author":"Lu","year":"2020","journal-title":"Cryptology ePrint Archive"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1038\/s41597-024-03656-8"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.52088\/ijesty.v2i3.291"},{"key":"ref21","volume-title":"Automating visual inspections for manufacturing with deep learning","year":"2020"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-319-24574-4_28"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.5555\/3294996.3295163"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.32604\/cmc.2024.048451"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1007\/s10845-019-01476-x"},{"key":"ref26","article-title":"Yolov12: Attention-centric real-time object detectors","author":"Tian","year":"2025","journal-title":"arXiv preprint"},{"key":"ref27","article-title":"Matching networks for one shot learning","volume":"29","author":"Vinyals","year":"2016","journal-title":"Advances in neural information processing systems"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1016\/j.knosys.2024.112168"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1007\/s40747-021-00600-w"}],"event":{"name":"2025 IEEE\/CVF International Conference on Computer Vision Workshops (ICCVW)","location":"Honolulu, HI, USA","start":{"date-parts":[[2025,10,19]]},"end":{"date-parts":[[2025,10,20]]}},"container-title":["2025 IEEE\/CVF International Conference on Computer Vision Workshops (ICCVW)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/11373940\/11374285\/11375470.pdf?arnumber=11375470","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,2,24]],"date-time":"2026-02-24T07:34:31Z","timestamp":1771918471000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11375470\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,10,19]]},"references-count":29,"URL":"https:\/\/doi.org\/10.1109\/iccvw69036.2025.00145","relation":{},"subject":[],"published":{"date-parts":[[2025,10,19]]}}}