{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,15]],"date-time":"2026-04-15T20:13:00Z","timestamp":1776283980165,"version":"3.50.1"},"reference-count":21,"publisher":"IEEE","license":[{"start":{"date-parts":[[2025,7,3]],"date-time":"2025-07-03T00:00:00Z","timestamp":1751500800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,7,3]],"date-time":"2025-07-03T00:00:00Z","timestamp":1751500800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2025,7,3]]},"DOI":"10.1109\/icecet63943.2025.11472447","type":"proceedings-article","created":{"date-parts":[[2026,4,9]],"date-time":"2026-04-09T19:42:35Z","timestamp":1775763755000},"page":"1-6","source":"Crossref","is-referenced-by-count":0,"title":["Optimizing FPGA and Wafer Test Coverage with Spatial Sampling and Machine Learning"],"prefix":"10.1109","author":[{"given":"Wang","family":"WeiQuan","sequence":"first","affiliation":[{"name":"Shimane University,Interdisciplinary Faculty of Science and Engineering,Matsue,Japan"}]},{"given":"Riaz-Ul-Haque","family":"Mian","sequence":"additional","affiliation":[{"name":"Shimane University,Interdisciplinary Faculty of Science and Engineering,Matsue,Japan"}]}],"member":"263","reference":[{"issue":"5","key":"ref1","first-page":"900","article-title":"Farthest-point sampling for wafer-level variation modeling","volume":"29","author":"Zhang","year":"2021","journal-title":"IEEE Transactions on Very Large Scale Integration (VLSI) Systems"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.7551\/mitpress\/3206.001.0001"},{"key":"ref3","first-page":"468","article-title":"Machine learning applications in semiconductor manufacturing: A review","volume":"57","author":"Lee","year":"2020","journal-title":"Journal of Manufacturing Systems"},{"issue":"4","key":"ref4","first-page":"1713","article-title":"Optimizing test yield in semiconductor production through hybrid sampling techniques","volume":"15","author":"Li","year":"2018","journal-title":"IEEE Transactions on Automation Science and Engineering"},{"issue":"3","key":"ref5","first-page":"391","article-title":"Advanced test strategies for semi-conductor wafer inspection using machine learning","volume":"32","author":"Nguyen","year":"2019","journal-title":"IEEE Transactions on Semiconductor Manufacturing"},{"issue":"12","key":"ref6","first-page":"2450","article-title":"Uncertainty-driven sampling for efficient wafer testing","volume":"40","author":"Chen","year":"2021","journal-title":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1587\/transfun.2023eap1115"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ITC50571.2021.00018"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1007\/978-1-4615-7566-5"},{"key":"ref10","first-page":"92 892","article-title":"A survey of spatial sampling techniques for industrial applications","volume":"7","author":"Garc\u00eda","year":"2019","journal-title":"IEEE Access"},{"key":"ref11","first-page":"113436","article-title":"Comparison of sampling techniques for RF test data in semiconductor manufacturing","volume":"123\u2013125","author":"Roy","year":"2021","journal-title":"Microelectronics Reliability"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1007\/s10836-025-06180-8"},{"key":"ref13","first-page":"107637","article-title":"Efficient large-scale GPR via inducing-point sampling in spatial domains","volume":"110","author":"Zhao","year":"2021","journal-title":"Pattern Recognition"},{"issue":"2","key":"ref14","first-page":"278","article-title":"A stratified sampling strategy for semiconductor quality prediction","volume":"31","author":"Chen","year":"2018","journal-title":"IEEE Transactions on Semiconductor Manufacturing"},{"issue":"14","key":"ref15","first-page":"17 300","article-title":"Spatial stratified sampling for environmental monitoring applied to wafer testing","volume":"27","author":"Park","year":"2020","journal-title":"Environmental Science and Pollution Research"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1016\/j.patrec.2009.09.011"},{"issue":"3","key":"ref17","first-page":"45:1","article-title":"Adaptive sampling strategies for FPGA testing using deep gaussian processes","volume":"26","author":"Kumar","year":"2021","journal-title":"ACM Transactions on Design Automation of Electronic Systems"},{"key":"ref18","first-page":"12 000","article-title":"Hybrid spatial-value sampling for process monitoring in IC fabrication","volume":"9","author":"Li","year":"2021","journal-title":"IEEE Access"},{"issue":"4","key":"ref19","first-page":"1100","article-title":"Distance-based clustering for sensor placement in wafer inspection","volume":"20","author":"Das","year":"2020","journal-title":"Sensors"},{"key":"ref20","first-page":"107254","article-title":"Graph-based sampling in gaussian process models for semiconductor reliability prediction","volume":"205","author":"Singh","year":"2021","journal-title":"Reliability Engineering & System Safety"},{"issue":"1","key":"ref21","first-page":"1","article-title":"Active learning for spatial sampling in semiconductor testing","volume":"34","author":"Xu","year":"2021","journal-title":"IEEE Transactions on Semiconductor Manufacturing"}],"event":{"name":"2025 5th International Conference on Electrical, Computer and Energy Technologies (ICECET)","location":"Paris, France","start":{"date-parts":[[2025,7,3]]},"end":{"date-parts":[[2025,7,6]]}},"container-title":["2025 5th International Conference on Electrical, Computer and Energy Technologies (ICECET)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/11471878\/11471697\/11472447.pdf?arnumber=11472447","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,4,15]],"date-time":"2026-04-15T19:23:15Z","timestamp":1776280995000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11472447\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,7,3]]},"references-count":21,"URL":"https:\/\/doi.org\/10.1109\/icecet63943.2025.11472447","relation":{},"subject":[],"published":{"date-parts":[[2025,7,3]]}}}