{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,8,6]],"date-time":"2024-08-06T03:54:19Z","timestamp":1722916459097},"reference-count":11,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"DOI":"10.1109\/icecs.2002.1046282","type":"proceedings-article","created":{"date-parts":[[2003,6,25]],"date-time":"2003-06-25T23:45:08Z","timestamp":1056584708000},"page":"765-768","source":"Crossref","is-referenced-by-count":0,"title":["A wire load model considering metal layer properties"],"prefix":"10.1109","volume":"2","author":[{"given":"A.","family":"Windschiegl","sequence":"first","affiliation":[]},{"given":"T.","family":"Mahnke","sequence":"additional","affiliation":[]},{"given":"M.","family":"Eiermann","sequence":"additional","affiliation":[]},{"given":"W.","family":"Stechele","sequence":"additional","affiliation":[]},{"given":"P.","family":"Zuber","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref4","first-page":"198","article-title":"CMOS Digital Integrated Circuits","author":"kang","year":"1999"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.1998.144268"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/43.918209"},{"journal-title":"Design Compiler Reference Manual v 1999–10","first-page":"3","year":"1999","key":"ref6"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1145\/333032.333041"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1145\/368640.368719"},{"key":"ref8","first-page":"128","article-title":"A DSM design flow: putting floorplanning, technology-mapping, and gate-placement together","author":"salek","year":"1998","journal-title":"Proceedings 1998 Design and Automation Conference 35th DAC (Cat No 98CH36175) DAC"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.1989.76976"},{"journal-title":"National Technology Roadmap for Semiconductors","first-page":"101","year":"1997","key":"ref2"},{"year":"2001","key":"ref9"},{"journal-title":"Status 1999 A report on the integrated circuit industry","first-page":"8","year":"1999","key":"ref1"}],"event":{"name":"9th International Conference on Electronics, Circuits and Systems (ICECS 2002)","acronym":"ICECS-02","location":"Dubrovnik, Croatia"},"container-title":["9th International Conference on Electronics, Circuits and Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/8101\/22423\/01046282.pdf?arnumber=1046282","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,10]],"date-time":"2017-03-10T21:01:31Z","timestamp":1489179691000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/1046282\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[null]]},"references-count":11,"URL":"https:\/\/doi.org\/10.1109\/icecs.2002.1046282","relation":{},"subject":[]}}