{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,18]],"date-time":"2026-03-18T00:03:28Z","timestamp":1773792208473,"version":"3.50.1"},"reference-count":15,"publisher":"IEEE","license":[{"start":{"date-parts":[[2007,12,1]],"date-time":"2007-12-01T00:00:00Z","timestamp":1196467200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2007,12,1]],"date-time":"2007-12-01T00:00:00Z","timestamp":1196467200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2007,12]]},"DOI":"10.1109\/icecs.2007.4510958","type":"proceedings-article","created":{"date-parts":[[2008,5,5]],"date-time":"2008-05-05T16:21:05Z","timestamp":1210004465000},"page":"174-177","source":"Crossref","is-referenced-by-count":10,"title":["Cooling management of a protruding electronic components by using a phase change material heat sink"],"prefix":"10.1109","author":[{"given":"Mustapha","family":"Faraji","sequence":"first","affiliation":[{"name":"Universit\u00e9 Cadi Ayyad, Facult\u00e9 des Sciences Semlalia, d\u00e9partement de physique, Laboratoire de m\u00e9canique des fluides et d'\u00e9nerg\u00e9tique, B.P 2390, Marrakech, Maroc. Email: farajimustapha@yahoo.fr"}]},{"given":"Hamid","family":"El Qarnia","sequence":"additional","affiliation":[{"name":"Universit\u00e9 Cadi Ayyad, Facult\u00e9 des Sciences Semlalia, d\u00e9partement de physique, Laboratoire de m\u00e9canique des fluides et d'\u00e9nerg\u00e9tique, B.P 2390, Marrakech, Maroc"}]}],"member":"263","reference":[{"key":"ref10","author":"mustapha","year":"0","journal-title":"Optimisation d'un systeme de stockage d'energie par chaleur latente de fusion application au refroidissement d'une composante electronique accepted in JITH France 28–29 30–8 2007"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1016\/j.applthermaleng.2006.12.013"},{"key":"ref12","article-title":"Optimisation of phase change heat sink for extreme environments","year":"0","journal-title":"Jason Leland Gerald Recktenwald Mechanical Engineering Department Portland State University Thermal Measurement and Management March 11–13–2003"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1016\/j.applthermaleng.2003.09.005"},{"key":"ref14","author":"carslaw","year":"1959","journal-title":"Conduction of Heat in Solids"},{"key":"ref15","author":"patankar","year":"1983","journal-title":"Numerical Heat Transfer and Fluid Flow Hemisphere"},{"key":"ref4","author":"tummala","year":"2001","journal-title":"Fundamentals of Microsystems Packaging"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1016\/j.applthermaleng.2003.12.029"},{"key":"ref6","first-page":"421","article-title":"The study of a small centrifugal fan for notebook computer","volume":"22","author":"lin","year":"2001","journal-title":"Journal of the Chinese Society of Mechanical Engineers"},{"key":"ref5","article-title":"Integrated circuit package types and thermal characteristics","volume":"12","author":"joiner","year":"2006","journal-title":"Electron Cool"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1002\/nme.1620240119"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1080\/10407789608913826"},{"key":"ref2","year":"0","journal-title":"12 Wansbeck Business Park Ashington Northumberland NE63 8QW UK Tel +44–1670–859500 Fax +44–1670-859539 Two Phase Shelf\/Sub Rack\/Rack Cooling solutions"},{"key":"ref1","article-title":"Liquid cooling of electronics devices by single phase convection","author":"incropera","year":"1999","journal-title":"Wiley series in Thermal Management of Microelectronics and Electronics Systems"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1080\/10407799308955883"}],"event":{"name":"2007 14th IEEE International Conference on Electronics, Circuits and Systems","location":"Marrakech, Morocco","start":{"date-parts":[[2007,12,11]]},"end":{"date-parts":[[2007,12,14]]}},"container-title":["2007 14th IEEE International Conference on Electronics, Circuits and Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/4456901\/4510892\/04510958.pdf?arnumber=4510958","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,3,17]],"date-time":"2026-03-17T20:20:25Z","timestamp":1773778825000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/4510958\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2007,12]]},"references-count":15,"URL":"https:\/\/doi.org\/10.1109\/icecs.2007.4510958","relation":{},"subject":[],"published":{"date-parts":[[2007,12]]}}}