{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,11]],"date-time":"2026-02-11T00:19:19Z","timestamp":1770769159184,"version":"3.50.0"},"reference-count":24,"publisher":"IEEE","license":[{"start":{"date-parts":[[2025,11,17]],"date-time":"2025-11-17T00:00:00Z","timestamp":1763337600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,11,17]],"date-time":"2025-11-17T00:00:00Z","timestamp":1763337600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100000266","name":"Engineering and Physical Sciences Research Council","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100000266","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2025,11,17]]},"DOI":"10.1109\/icecs66544.2025.11270557","type":"proceedings-article","created":{"date-parts":[[2025,12,9]],"date-time":"2025-12-09T18:31:34Z","timestamp":1765305094000},"page":"1-5","source":"Crossref","is-referenced-by-count":0,"title":["Design of a Retentive and Single-Event Upset Tolerant TSPC Flip-Flop"],"prefix":"10.1109","author":[{"given":"Ahmet","family":"Cirakoglu","sequence":"first","affiliation":[{"name":"University of Edinburgh,Centre for Electronics Frontiers, Institute for Integrated Micro and Nano Systems, School of Engineering,Edinburgh,United Kingdom"}]},{"given":"Alex","family":"Serb","sequence":"additional","affiliation":[{"name":"University of Edinburgh,Centre for Electronics Frontiers, Institute for Integrated Micro and Nano Systems, School of Engineering,Edinburgh,United Kingdom"}]},{"given":"Khaled","family":"Humood","sequence":"additional","affiliation":[{"name":"University of Edinburgh,Centre for Electronics Frontiers, Institute for Integrated Micro and Nano Systems, School of Engineering,Edinburgh,United Kingdom"}]},{"given":"Mark","family":"Zwolinski","sequence":"additional","affiliation":[{"name":"University of Southampton,School of Electronics and Computer Science,Southampton,UK,SO17 1BJ"}]},{"given":"Themis","family":"Prodromakis","sequence":"additional","affiliation":[{"name":"University of Edinburgh,Centre for Electronics Frontiers, Institute for Integrated Micro and Nano Systems, School of Engineering,Edinburgh,United Kingdom"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1038\/s41928-021-00562-4"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/MAES.2020.3008468"},{"issue":"13","key":"ref3","article-title":"Categorization and seu fault simulations of radiation-hardened-by-design flip-flops","volume-title":"Electronics","volume":"10","author":"Hamed","year":"2021"},{"issue":"19","key":"ref4","article-title":"A novel radiation-hardened ccdm-tspc compared with seven well-known rhbd flip-flops in 180 nm cmos process","volume-title":"Electronics","volume":"11","author":"Wang","year":"2022"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/VTS65138.2025.11022826"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2022.3168082"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2023.3284758"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.3389\/felec.2025.1567562"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1016\/j.mejo.2024.106420"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/DSD51259.2020.00101"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/VLSID.2019.00077"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.5573\/IEIESPC.2021.10.2.167"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2017.2763423"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2019.8702680"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2021.3061921"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/MNRC15848.2009.5338963"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/MWSCAS.2010.5548564"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2014.6757516"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/ASICON.2011.6157169"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TNANO.2019.2946108"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/NewCAS58973.2024.10666360"},{"issue":"13","key":"ref22","article-title":"Categorization and seu fault simulations of radiation-hardened-by-design flip-flops","volume-title":"Electronics","volume":"10","author":"Hamed","year":"2021"},{"key":"ref23","first-page":"47","article-title":"Chapter 3 - a taxonomy and survey of energy-efficient data centers and cloud computing systems","volume":"82","author":"Beloglazov","year":"2011"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.1974.1050511"}],"event":{"name":"2025 32nd IEEE International Conference on Electronics, Circuits and Systems (ICECS)","location":"Marrakech, Morocco","start":{"date-parts":[[2025,11,17]]},"end":{"date-parts":[[2025,11,19]]}},"container-title":["2025 32nd IEEE International Conference on Electronics, Circuits and Systems (ICECS)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/11270487\/11270494\/11270557.pdf?arnumber=11270557","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,2,10]],"date-time":"2026-02-10T20:59:07Z","timestamp":1770757147000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11270557\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,11,17]]},"references-count":24,"URL":"https:\/\/doi.org\/10.1109\/icecs66544.2025.11270557","relation":{},"subject":[],"published":{"date-parts":[[2025,11,17]]}}}