{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,7]],"date-time":"2024-09-07T20:51:53Z","timestamp":1725742313575},"reference-count":2,"publisher":"IEEE","license":[{"start":{"date-parts":[[2024,1,28]],"date-time":"2024-01-28T00:00:00Z","timestamp":1706400000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,1,28]],"date-time":"2024-01-28T00:00:00Z","timestamp":1706400000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100003725","name":"National Research Foundation of Korea (NRF)","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100003725","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100003836","name":"IC Design Education Center (IDEC), Korea","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100003836","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024,1,28]]},"DOI":"10.1109\/iceic61013.2024.10457160","type":"proceedings-article","created":{"date-parts":[[2024,3,19]],"date-time":"2024-03-19T18:06:51Z","timestamp":1710871611000},"page":"1-2","source":"Crossref","is-referenced-by-count":0,"title":["Hardware and Software Co-Simulation Methodology for Processing-in-Memory Bitcell application"],"prefix":"10.1109","author":[{"given":"Jae-Gun","family":"Lee","sequence":"first","affiliation":[{"name":"School of Electrical Engineering, Hanyang University,Ansan,South Korea"}]},{"given":"Shin-Uk","family":"Kang","sequence":"additional","affiliation":[{"name":"School of Electrical Engineering, Hanyang University,Ansan,South Korea"}]},{"given":"Min-Seong","family":"Choo","sequence":"additional","affiliation":[{"name":"School of Electrical Engineering, Hanyang University,Ansan,South Korea"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2963616"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2020.3036209"}],"event":{"name":"2024 International Conference on Electronics, Information, and Communication (ICEIC)","start":{"date-parts":[[2024,1,28]]},"location":"Taipei, Taiwan","end":{"date-parts":[[2024,1,31]]}},"container-title":["2024 International Conference on Electronics, Information, and Communication (ICEIC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/10457047\/10457087\/10457160.pdf?arnumber=10457160","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,3,26]],"date-time":"2024-03-26T17:57:59Z","timestamp":1711475879000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10457160\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,1,28]]},"references-count":2,"URL":"https:\/\/doi.org\/10.1109\/iceic61013.2024.10457160","relation":{},"subject":[],"published":{"date-parts":[[2024,1,28]]}}}