{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,15]],"date-time":"2026-01-15T23:12:45Z","timestamp":1768518765118,"version":"3.49.0"},"reference-count":4,"publisher":"IEEE","license":[{"start":{"date-parts":[[2025,1,19]],"date-time":"2025-01-19T00:00:00Z","timestamp":1737244800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,1,19]],"date-time":"2025-01-19T00:00:00Z","timestamp":1737244800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2025,1,19]]},"DOI":"10.1109\/iceic64972.2025.10879743","type":"proceedings-article","created":{"date-parts":[[2025,2,18]],"date-time":"2025-02-18T18:17:22Z","timestamp":1739902642000},"page":"1-4","source":"Crossref","is-referenced-by-count":1,"title":["Design and Analysis of Static-Free PAM-4 Transmitter for HBM TSV Interface"],"prefix":"10.1109","author":[{"given":"Jeonghyeok","family":"You","sequence":"first","affiliation":[{"name":"School of Electrical and Electronic Engineering, Yonsei University,Seoul,South Korea"}]},{"given":"Hohyun","family":"Chae","sequence":"additional","affiliation":[{"name":"School of Electrical and Electronic Engineering, Yonsei University,Seoul,South Korea"}]},{"given":"Taeryeong","family":"Kim","sequence":"additional","affiliation":[{"name":"School of Electrical and Electronic Engineering, Yonsei University,Seoul,South Korea"}]},{"given":"Ji Hoon","family":"Lee","sequence":"additional","affiliation":[{"name":"School of Electrical and Electronic Engineering, Yonsei University,Seoul,South Korea"}]},{"given":"Seong-Ook","family":"Jung","sequence":"additional","affiliation":[{"name":"School of Electrical and Electronic Engineering, Yonsei University,Seoul,South Korea"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2022.3193354"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2023.3285896"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.23919\/VLSITechnologyandCir57934.2023.10185328"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.3042240"}],"event":{"name":"2025 International Conference on Electronics, Information, and Communication (ICEIC)","location":"Osaka, Japan","start":{"date-parts":[[2025,1,19]]},"end":{"date-parts":[[2025,1,22]]}},"container-title":["2025 International Conference on Electronics, Information, and Communication (ICEIC)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/10879455\/10879601\/10879743.pdf?arnumber=10879743","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,2,20]],"date-time":"2025-02-20T20:01:08Z","timestamp":1740081668000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10879743\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,1,19]]},"references-count":4,"URL":"https:\/\/doi.org\/10.1109\/iceic64972.2025.10879743","relation":{},"subject":[],"published":{"date-parts":[[2025,1,19]]}}}