{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,8,29]],"date-time":"2025-08-29T10:14:47Z","timestamp":1756462487083,"version":"3.28.0"},"reference-count":7,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2012,5]]},"DOI":"10.1109\/icicdt.2012.6232854","type":"proceedings-article","created":{"date-parts":[[2012,7,19]],"date-time":"2012-07-19T23:42:57Z","timestamp":1342741377000},"page":"1-4","source":"Crossref","is-referenced-by-count":2,"title":["Evaluation of non-destructive etch depth measurement for through silicon vias"],"prefix":"10.1109","author":[{"given":"Thuy","family":"Dao","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Tania","family":"Thomas","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"David","family":"Marx","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"David","family":"Grant","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"3","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2007.373865"},{"key":"2","article-title":"Through silicon via stress characterization","author":"dao","year":"0","journal-title":"ICIC 2009"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1109\/IITC.2009.5090341"},{"key":"7","doi-asserted-by":"crossref","first-page":"419","DOI":"10.1109\/TSM.2010.2046657","article-title":"Backside infrared interferometric patterned wafer thickness sensing for through-silicon-via (TSV) etch metrology","volume":"23","author":"teh","year":"2010","journal-title":"IEEE Trans Semi Manufac"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1109\/3DIC.2009.5306536"},{"key":"5","article-title":"Model-based infrared spectroscopy: New opportunities for in-line process control","author":"mantz","year":"0","journal-title":"Metrology \/ Failure Analysis"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1063\/1.2063029"}],"event":{"name":"2012 IEEE International Conference on IC Design & Technology (ICICDT)","start":{"date-parts":[[2012,5,30]]},"location":"Austin, TX, USA","end":{"date-parts":[[2012,6,1]]}},"container-title":["2012 IEEE International Conference on IC Design & Technology"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/6225515\/6232832\/06232854.pdf?arnumber=6232854","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,20]],"date-time":"2017-06-20T21:37:52Z","timestamp":1497994672000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6232854\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2012,5]]},"references-count":7,"URL":"https:\/\/doi.org\/10.1109\/icicdt.2012.6232854","relation":{},"subject":[],"published":{"date-parts":[[2012,5]]}}}