{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,8]],"date-time":"2024-09-08T06:14:36Z","timestamp":1725776076746},"reference-count":9,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2012,5]]},"DOI":"10.1109\/icicdt.2012.6232855","type":"proceedings-article","created":{"date-parts":[[2012,7,19]],"date-time":"2012-07-19T19:42:57Z","timestamp":1342726977000},"page":"1-4","source":"Crossref","is-referenced-by-count":9,"title":["3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps"],"prefix":"10.1109","author":[{"given":"W.","family":"Guo","sequence":"first","affiliation":[]},{"given":"G.","family":"Van Der Plas","sequence":"additional","affiliation":[]},{"given":"A.","family":"Ivankovic","sequence":"additional","affiliation":[]},{"given":"G.","family":"Eneman","sequence":"additional","affiliation":[]},{"given":"V.","family":"Cherman","sequence":"additional","affiliation":[]},{"given":"B.","family":"De Wachter","sequence":"additional","affiliation":[]},{"given":"A.","family":"Mercha","sequence":"additional","affiliation":[]},{"given":"M.","family":"Gonzalez","sequence":"additional","affiliation":[]},{"given":"Y.","family":"Civale","sequence":"additional","affiliation":[]},{"given":"A.","family":"Redolfi","sequence":"additional","affiliation":[]},{"given":"T.","family":"Buisson","sequence":"additional","affiliation":[]},{"given":"A.","family":"Jourdan","sequence":"additional","affiliation":[]},{"given":"B.","family":"Vandevelde","sequence":"additional","affiliation":[]},{"given":"K.J.","family":"Rebibis","sequence":"additional","affiliation":[]},{"given":"I.","family":"De Wolf","sequence":"additional","affiliation":[]},{"given":"A.","family":"La Manna","sequence":"additional","affiliation":[]},{"given":"G.","family":"Beyer","sequence":"additional","affiliation":[]},{"given":"E.","family":"Beyne","sequence":"additional","affiliation":[]},{"given":"B.","family":"Swinnen","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"doi-asserted-by":"publisher","key":"3","DOI":"10.1109\/ISSCC.2010.5434016"},{"doi-asserted-by":"publisher","key":"2","DOI":"10.1109\/IEDM.2008.4796763"},{"doi-asserted-by":"publisher","key":"1","DOI":"10.1109\/IITC.2006.1648629"},{"year":"2010","author":"okoro","journal-title":"Thermo-Mechanical Characterization of Copper Through-Silicon-Via Interconnect for 3D Chip Stacking","key":"7"},{"doi-asserted-by":"publisher","key":"6","DOI":"10.1109\/3DIC.2012.6262972"},{"doi-asserted-by":"publisher","key":"5","DOI":"10.1109\/EPTC.2011.6184381"},{"doi-asserted-by":"publisher","key":"4","DOI":"10.1109\/IEDM.2010.5703278"},{"key":"9","article-title":"Electrical, thermal and mechanical impact of 3D TSV and 3S stacking technology on advanced CMOS devices-technology directions","author":"beyne","year":"2012","journal-title":"Proc 3DIC-2011"},{"doi-asserted-by":"publisher","key":"8","DOI":"10.1109\/DATE.2011.5763088"}],"event":{"name":"2012 IEEE International Conference on IC Design & Technology (ICICDT)","start":{"date-parts":[[2012,5,30]]},"location":"Austin, TX, USA","end":{"date-parts":[[2012,6,1]]}},"container-title":["2012 IEEE International Conference on IC Design & Technology"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx5\/6225515\/6232832\/06232855.pdf?arnumber=6232855","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,21]],"date-time":"2017-03-21T11:37:32Z","timestamp":1490096252000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6232855\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2012,5]]},"references-count":9,"URL":"https:\/\/doi.org\/10.1109\/icicdt.2012.6232855","relation":{},"subject":[],"published":{"date-parts":[[2012,5]]}}}