{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,29]],"date-time":"2026-04-29T22:31:48Z","timestamp":1777501908358,"version":"3.51.4"},"reference-count":16,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2013,5]]},"DOI":"10.1109\/icicdt.2013.6563343","type":"proceedings-article","created":{"date-parts":[[2013,8,14]],"date-time":"2013-08-14T12:20:40Z","timestamp":1376482840000},"page":"231-234","source":"Crossref","is-referenced-by-count":3,"title":["Smart Stacking™ and Smart Cut™ technologies for wafer level 3D integration"],"prefix":"10.1109","author":[{"given":"Mariam","family":"Sadaka","sequence":"first","affiliation":[]},{"given":"Ionut","family":"Radu","sequence":"additional","affiliation":[]},{"given":"Chrystelle","family":"Lagahe-Blanchard","sequence":"additional","affiliation":[]},{"given":"Lea","family":"Di Cioccio","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"15","first-page":"132","article-title":"Systematic study of the splitting kinetic of H\/He Co-implanted substrate","author":"nguyen","year":"2003","journal-title":"SOI Conf"},{"key":"16","article-title":"Wafer-Level 3D stacking using smart cut and Metal-Metal direct bonding technology","author":"di cioccio","year":"2012","journal-title":"Presented at E14-Semiconductor Wafer Bonding 12 Science Technology and Applications ECS PRIME Honolulu"},{"key":"13","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2011.6131502"},{"key":"14","doi-asserted-by":"publisher","DOI":"10.1049\/el:19950805"},{"key":"11","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2010.5490697"},{"key":"12","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2010.5490904"},{"key":"3","year":"2010"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2010.5654160"},{"key":"1","year":"0"},{"key":"10","first-page":"1","article-title":"Recent advances in submicron alignment 300mm Copper-Copper thermocompressive Face-to-Face Wafer-to-Wafer bonding and integrated infrared, high-speed FIB metrology","author":"teh","year":"2010","journal-title":"Interconnect Technology Conference (IITC)"},{"key":"7","year":"0"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1109\/3DIC.2010.5751454"},{"key":"5","doi-asserted-by":"publisher","DOI":"10.1109\/3DIC.2010.5751472"},{"key":"4","doi-asserted-by":"publisher","DOI":"10.1557\/PROC-1112-E01-06"},{"key":"9","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2006.873424"},{"key":"8","article-title":"Building blocks for Wafer-Level 3D integration","author":"sadaka","year":"2009","journal-title":"Solid State Technology"}],"event":{"name":"2013 International Conference on IC Design & Technology (ICICDT)","location":"Pavia, Italy","start":{"date-parts":[[2013,5,29]]},"end":{"date-parts":[[2013,5,31]]}},"container-title":["Proceedings of 2013 International Conference on IC Design & Technology (ICICDT)"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6556112\/6563281\/06563343.pdf?arnumber=6563343","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,3,22]],"date-time":"2017-03-22T17:11:58Z","timestamp":1490202718000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6563343\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2013,5]]},"references-count":16,"URL":"https:\/\/doi.org\/10.1109\/icicdt.2013.6563343","relation":{},"subject":[],"published":{"date-parts":[[2013,5]]}}}