{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,8]],"date-time":"2024-09-08T08:24:28Z","timestamp":1725783868823},"reference-count":12,"publisher":"IEEE","content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2014,5]]},"DOI":"10.1109\/icicdt.2014.6838583","type":"proceedings-article","created":{"date-parts":[[2014,7,28]],"date-time":"2014-07-28T19:03:50Z","timestamp":1406574230000},"page":"1-4","source":"Crossref","is-referenced-by-count":2,"title":["3D serial TSV link for low-power chip-to-chip communication"],"prefix":"10.1109","author":[{"given":"Giulia","family":"Beanato","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Alessandro","family":"Cevrero","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Giovanni","family":"De Michel","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yusuf","family":"Leblebici","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"3","doi-asserted-by":"publisher","DOI":"10.1109\/75.91090"},{"key":"2","doi-asserted-by":"publisher","DOI":"10.1109\/SBCCI.2013.6644891"},{"journal-title":"Three-Dimensional Integrated Circuit Design","year":"2009","author":"pavlidis","key":"10"},{"key":"1","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2010.5654245"},{"key":"7","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.1996.488536"},{"key":"6","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2009.2034508"},{"year":"2013","key":"5"},{"year":"2013","key":"4"},{"key":"9","doi-asserted-by":"crossref","first-page":"581","DOI":"10.1145\/1629911.1630061","article-title":"exploring serial vertical interconnects for 3d ics","author":"pasricha","year":"2009","journal-title":"2009 46th ACM\/IEEE Design Automation Conference dac"},{"key":"8","doi-asserted-by":"crossref","first-page":"142","DOI":"10.1109\/ISSCC.2012.6176900","article-title":"A compact low-power 3d i\/o in 45nm cmos","author":"liu","year":"2012","journal-title":"Solid-State Circuits Conference Digest of Technical Papers (ISSCC) 2012 IEEE International"},{"key":"11","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2010.2074070"},{"key":"12","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2011.5746311"}],"event":{"name":"2014 IEEE International Conference on IC Design & Technology (ICICDT)","start":{"date-parts":[[2014,5,28]]},"location":"Austin, TX, USA","end":{"date-parts":[[2014,5,30]]}},"container-title":["2014 IEEE International Conference on IC Design & Technology"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6832295\/6838579\/06838583.pdf?arnumber=6838583","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2017,6,22]],"date-time":"2017-06-22T17:25:58Z","timestamp":1498152358000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6838583\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2014,5]]},"references-count":12,"URL":"https:\/\/doi.org\/10.1109\/icicdt.2014.6838583","relation":{},"subject":[],"published":{"date-parts":[[2014,5]]}}}